High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique

Shigeru Kanazawa, Takeshi Fujisawa, Hiroyuki Ishii, Kiyoto Takahata, Yuta Ueda, Ryuzo Iga, Hiroaki Sanjoh

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

We fabricated a 400-G flip-chip interconnection eight-channel EADFB laser array module. The flip-chip interconnection technique provides a higher modulation bandwidth and lower electrical crosstalk than the wire interconnection technique. The 3-dB bandwidth of the flip-chip interconnection subassembly was about 50 GHz. And the electrical crosstalk of the flip-chip interconnection module was suppressed to less than -20 dB below 35 GHz. We obtained clear eye openings for all eight lanes under eight-channel 50-Gb/s simultaneous operation after a 10-km SMF transmission.

Original languageEnglish
Article number7064702
JournalIEEE Journal on Selected Topics in Quantum Electronics
Volume21
Issue number6
DOIs
Publication statusPublished - 2015 Nov 1
Externally publishedYes

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laser arrays
Crosstalk
modules
chips
high speed
Bandwidth
Lasers
crosstalk
Modulation
Wire
subassemblies
bandwidth
wire
modulation

Keywords

  • 400 Gigabit Ethernet
  • Distributed feedback laser
  • EADFB laser array
  • Electro-absorption modulator
  • InGaAlAs
  • Photonic integrated circuits

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

Cite this

High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique. / Kanazawa, Shigeru; Fujisawa, Takeshi; Ishii, Hiroyuki; Takahata, Kiyoto; Ueda, Yuta; Iga, Ryuzo; Sanjoh, Hiroaki.

In: IEEE Journal on Selected Topics in Quantum Electronics, Vol. 21, No. 6, 7064702, 01.11.2015.

Research output: Contribution to journalArticle

Kanazawa, Shigeru ; Fujisawa, Takeshi ; Ishii, Hiroyuki ; Takahata, Kiyoto ; Ueda, Yuta ; Iga, Ryuzo ; Sanjoh, Hiroaki. / High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique. In: IEEE Journal on Selected Topics in Quantum Electronics. 2015 ; Vol. 21, No. 6.
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