High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique

Shigeru Kanazawa; Takeshi Fujisawa; Hiroyuki Ishii; Kiyoto Takahata; Yuta Ueda; Ryuzo Iga; Hiroaki Sanjoh

doi:10.1109/JSTQE.2015.2415197

High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique

Shigeru Kanazawa, Takeshi Fujisawa, Hiroyuki Ishii, Kiyoto Takahata, Yuta Ueda, Ryuzo Iga, Hiroaki Sanjoh

Research output: Contribution to journal › Article

11 Citations (Scopus)

Abstract

We fabricated a 400-G flip-chip interconnection eight-channel EADFB laser array module. The flip-chip interconnection technique provides a higher modulation bandwidth and lower electrical crosstalk than the wire interconnection technique. The 3-dB bandwidth of the flip-chip interconnection subassembly was about 50 GHz. And the electrical crosstalk of the flip-chip interconnection module was suppressed to less than -20 dB below 35 GHz. We obtained clear eye openings for all eight lanes under eight-channel 50-Gb/s simultaneous operation after a 10-km SMF transmission.

Original language	English
Article number	7064702
Journal	IEEE Journal on Selected Topics in Quantum Electronics
Volume	21
Issue number	6
DOIs	https://doi.org/10.1109/JSTQE.2015.2415197
Publication status	Published - 2015 Nov 1
Externally published	Yes

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Keywords

400 Gigabit Ethernet
Distributed feedback laser
EADFB laser array
Electro-absorption modulator
InGaAlAs
Photonic integrated circuits

ASJC Scopus subject areas

Electrical and Electronic Engineering
Atomic and Molecular Physics, and Optics

Cite this

Kanazawa, S., Fujisawa, T., Ishii, H., Takahata, K., Ueda, Y., Iga, R., & Sanjoh, H. (2015). High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique. IEEE Journal on Selected Topics in Quantum Electronics, 21(6), [7064702]. https://doi.org/10.1109/JSTQE.2015.2415197

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10.1109/JSTQE.2015.2415197