Abstract
We fabricated a 400-G flip-chip interconnection eight-channel EADFB laser array module. The flip-chip interconnection technique provides a higher modulation bandwidth and lower electrical crosstalk than the wire interconnection technique. The 3-dB bandwidth of the flip-chip interconnection subassembly was about 50 GHz. And the electrical crosstalk of the flip-chip interconnection module was suppressed to less than -20 dB below 35 GHz. We obtained clear eye openings for all eight lanes under eight-channel 50-Gb/s simultaneous operation after a 10-km SMF transmission.
Original language | English |
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Article number | 7064702 |
Pages (from-to) | 183-188 |
Number of pages | 6 |
Journal | IEEE Journal of Selected Topics in Quantum Electronics |
Volume | 21 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2015 Nov 1 |
Externally published | Yes |
Keywords
- 400 Gigabit Ethernet
- Distributed feedback laser
- EADFB laser array
- Electro-absorption modulator
- InGaAlAs
- Photonic integrated circuits
ASJC Scopus subject areas
- Atomic and Molecular Physics, and Optics
- Electrical and Electronic Engineering