High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique

Shigeru Kanazawa, Takeshi Fujisawa, Hiroyuki Ishii, Kiyoto Takahata, Yuta Ueda, Ryuzo Iga, Hiroaki Sanjoh

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)


We fabricated a 400-G flip-chip interconnection eight-channel EADFB laser array module. The flip-chip interconnection technique provides a higher modulation bandwidth and lower electrical crosstalk than the wire interconnection technique. The 3-dB bandwidth of the flip-chip interconnection subassembly was about 50 GHz. And the electrical crosstalk of the flip-chip interconnection module was suppressed to less than -20 dB below 35 GHz. We obtained clear eye openings for all eight lanes under eight-channel 50-Gb/s simultaneous operation after a 10-km SMF transmission.

Original languageEnglish
Article number7064702
Pages (from-to)183-188
Number of pages6
JournalIEEE Journal of Selected Topics in Quantum Electronics
Issue number6
Publication statusPublished - 2015 Nov 1
Externally publishedYes


  • 400 Gigabit Ethernet
  • Distributed feedback laser
  • EADFB laser array
  • Electro-absorption modulator
  • InGaAlAs
  • Photonic integrated circuits

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering


Dive into the research topics of 'High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique'. Together they form a unique fingerprint.

Cite this