High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles

Kohei Tatsumi, Yasunori Tanaka, Tomonori Iizuka, Keiko Wada, Minoru Fukumori, Isamu Morisako, Yoon Jeongbin, Norihiro Murakawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recently there are high expectations for incorporating silicon carbide (SiC) devices as power modules in hybrid electric vehicles (HEV) and electric vehicles (EV). The need for new bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, has been strongly expected in order to maximize the performance of SiC power device. We developed a new micro-plating interconnection technology named Nickel Micro Plating Bonding (NMPB), which enables the interconnection in a narrow space between electrodes and SiC devices via our new lead frame formed in chevron shape. As for the bonding strength of NMPB, sufficient joint strength value is confirmed by shear test. We also newly proposed low-temperature nickel nanoparticle sintering to form die bonding connections. We have confirmed that bonding at a bonding temperature of 400 °C or lower is possible, and that it is a bonding having long-term high heat resistance. We implemented heat resistant mounting of SiC schottky barrier diode (SBD) on the TO247 type package and confirmed the I-V characteristics even after the high temperature storage at 300 °C without any significant degradation. We clarified that these methods had adequate potential as an advanced heat resistant package in comparison with conventional interconnections.

Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538668139
DOIs
Publication statusPublished - 2018 Nov 26
Event7th Electronic System-Integration Technology Conference, ESTC 2018 - Dresden, Germany
Duration: 2018 Sep 182018 Sep 21

Other

Other7th Electronic System-Integration Technology Conference, ESTC 2018
CountryGermany
CityDresden
Period18/9/1818/9/21

Keywords

  • High temperature reliability
  • Interconnection
  • Ni micro-plating
  • Ni nanoparticle
  • Power module
  • SiC

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Fingerprint Dive into the research topics of 'High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles'. Together they form a unique fingerprint.

  • Cite this

    Tatsumi, K., Tanaka, Y., Iizuka, T., Wada, K., Fukumori, M., Morisako, I., Jeongbin, Y., & Murakawa, N. (2018). High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings [8546378] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC.2018.8546378