High-temperature-resistant interconnection using nickel nanoparticles

Yasunori Tanaka, Suguru Hashimoto, Tomonori Iizuka, Kohei Tatsumi, Norie Matsubara, Shinji Ishikawa, Masamoto Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

The bonding characteristics of nickel nanoparticles as a new alternative bonding material for high-temperature soldering was considered and a high bonding strength was achieved at a bonding temperature of 300°C. It was also revealed in a bonding experiment using a silicon dummy chip with a deposited aluminum layer that direct bonding to an aluminum electrode was possible. On the other hand, a stress-relaxation structure using a metal film was presented as a new structure for resolving the problem of deteriorating bonding reliability due to thermal stress arising from differences in the coefficient of thermal expansion between the chip and the substrate. A silicon carbide device was assembled using the new bonding method and an operating test was performed to verify normal operation in a high-temperature environment of approximately 300°C.

Original languageEnglish
Title of host publicationProceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014
PublisherIMAPS-International Microelectronics and Packaging Society
Pages561-565
Number of pages5
ISBN (Print)9780990902805
Publication statusPublished - 2014
Event47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 - San Diego, United States
Duration: 2014 Oct 132014 Oct 16

Other

Other47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014
CountryUnited States
CitySan Diego
Period14/10/1314/10/16

Fingerprint

Nickel
Nanoparticles
Temperature
Aluminum
Soldering
Stress relaxation
Thermal stress
Silicon carbide
Thermal expansion
Silicon
Electrodes
Substrates
Metals
Experiments

Keywords

  • High temperature resistant packaging
  • Nickel nanoparticles
  • Power device interconnection

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Tanaka, Y., Hashimoto, S., Iizuka, T., Tatsumi, K., Matsubara, N., Ishikawa, S., & Tanaka, M. (2014). High-temperature-resistant interconnection using nickel nanoparticles. In Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014 (pp. 561-565). IMAPS-International Microelectronics and Packaging Society.

High-temperature-resistant interconnection using nickel nanoparticles. / Tanaka, Yasunori; Hashimoto, Suguru; Iizuka, Tomonori; Tatsumi, Kohei; Matsubara, Norie; Ishikawa, Shinji; Tanaka, Masamoto.

Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. IMAPS-International Microelectronics and Packaging Society, 2014. p. 561-565.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tanaka, Y, Hashimoto, S, Iizuka, T, Tatsumi, K, Matsubara, N, Ishikawa, S & Tanaka, M 2014, High-temperature-resistant interconnection using nickel nanoparticles. in Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. IMAPS-International Microelectronics and Packaging Society, pp. 561-565, 47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014, San Diego, United States, 14/10/13.
Tanaka Y, Hashimoto S, Iizuka T, Tatsumi K, Matsubara N, Ishikawa S et al. High-temperature-resistant interconnection using nickel nanoparticles. In Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. IMAPS-International Microelectronics and Packaging Society. 2014. p. 561-565
Tanaka, Yasunori ; Hashimoto, Suguru ; Iizuka, Tomonori ; Tatsumi, Kohei ; Matsubara, Norie ; Ishikawa, Shinji ; Tanaka, Masamoto. / High-temperature-resistant interconnection using nickel nanoparticles. Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. IMAPS-International Microelectronics and Packaging Society, 2014. pp. 561-565
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