High temperature resistant packaging for SiC power devices using interconnections formed by Ni micro-electro-plating and Ni nano-particles

Yasunori Tanaka, Keito Ota, Haruka Miyano, Yoshiaki Shigenaga, Tomonori Iizuka, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science