High temperature resistant packaging for SiC power devices using interconnections formed by Ni micro-electro-plating and Ni nano-particles

Yasunori Tanaka, Keito Ota, Haruka Miyano, Yoshiaki Shigenaga, Tomonori Iizuka, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Fingerprint Dive into the research topics of 'High temperature resistant packaging for SiC power devices using interconnections formed by Ni micro-electro-plating and Ni nano-particles'. Together they form a unique fingerprint.