High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding

Kohei Tatsumi, Isamu Morisako, Keiko Wada, Minoru Fukuomori, Tomonori Iizuka, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Masayuki Hikita, Rikiya Kamimura, Naoki Kawanabe, Kazuhiko Sugiura, Kazuhiro Tsuruta, Keiji Toda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science