High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka, Zengbin Wang, Tomonori Iizuka, Masahiro Kozako, Yoshimichi Ohki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

Original languageEnglish
Title of host publicationAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Pages691-694
Number of pages4
DOIs
Publication statusPublished - 2011
Event2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011 - Cancun, Mexico
Duration: 2011 Oct 162011 Oct 19

Other

Other2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011
CountryMexico
CityCancun
Period11/10/1611/10/19

Fingerprint

Electric breakdown
Thermal conductivity
Fillers
Composite materials
Silicon Dioxide
Surface treatment
Silica

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Tanaka, T., Wang, Z., Iizuka, T., Kozako, M., & Ohki, Y. (2011). High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP (pp. 691-694). [6232750] https://doi.org/10.1109/CEIDP.2011.6232750

High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength. / Tanaka, Toshikatsu; Wang, Zengbin; Iizuka, Tomonori; Kozako, Masahiro; Ohki, Yoshimichi.

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2011. p. 691-694 6232750.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tanaka, T, Wang, Z, Iizuka, T, Kozako, M & Ohki, Y 2011, High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength. in Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP., 6232750, pp. 691-694, 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011, Cancun, Mexico, 11/10/16. https://doi.org/10.1109/CEIDP.2011.6232750
Tanaka T, Wang Z, Iizuka T, Kozako M, Ohki Y. High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2011. p. 691-694. 6232750 https://doi.org/10.1109/CEIDP.2011.6232750
Tanaka, Toshikatsu ; Wang, Zengbin ; Iizuka, Tomonori ; Kozako, Masahiro ; Ohki, Yoshimichi. / High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength. Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2011. pp. 691-694
@inproceedings{6ac65fc3ac324a79bd213321dcde1226,
title = "High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength",
abstract = "Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.",
author = "Toshikatsu Tanaka and Zengbin Wang and Tomonori Iizuka and Masahiro Kozako and Yoshimichi Ohki",
year = "2011",
doi = "10.1109/CEIDP.2011.6232750",
language = "English",
pages = "691--694",
booktitle = "Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP",

}

TY - GEN

T1 - High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

AU - Tanaka, Toshikatsu

AU - Wang, Zengbin

AU - Iizuka, Tomonori

AU - Kozako, Masahiro

AU - Ohki, Yoshimichi

PY - 2011

Y1 - 2011

N2 - Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

AB - Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

UR - http://www.scopus.com/inward/record.url?scp=84864694945&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84864694945&partnerID=8YFLogxK

U2 - 10.1109/CEIDP.2011.6232750

DO - 10.1109/CEIDP.2011.6232750

M3 - Conference contribution

AN - SCOPUS:84864694945

SP - 691

EP - 694

BT - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

ER -