High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka, Zengbin Wang, Tomonori Iizuka, Masahiro Kozako, Yoshimichi Ohki

Research output: Contribution to journalConference article

4 Citations (Scopus)

Abstract

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

Original languageEnglish
Article number6232750
Pages (from-to)691-694
Number of pages4
JournalAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011 - Cancun, Mexico
Duration: 2011 Oct 162011 Oct 19

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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