High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka, Zengbin Wang, Tomonori Iizuka, Masahiro Kozako, Yoshimichi Ohki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m·K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

Original languageEnglish
Title of host publication2011 International Conference on Power and Energy Systems, ICPS 2011
DOIs
Publication statusPublished - 2011 Dec 1
Event4th International Conference on Power and Energy Systems, ICPS 2011 - Chennai, India
Duration: 2011 Dec 222011 Dec 24

Publication series

Name2011 International Conference on Power and Energy Systems, ICPS 2011

Conference

Conference4th International Conference on Power and Energy Systems, ICPS 2011
CountryIndia
CityChennai
Period11/12/2211/12/24

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Fuel Technology

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  • Cite this

    Tanaka, T., Wang, Z., Iizuka, T., Kozako, M., & Ohki, Y. (2011). High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength. In 2011 International Conference on Power and Energy Systems, ICPS 2011 [6156695] (2011 International Conference on Power and Energy Systems, ICPS 2011). https://doi.org/10.1109/ICPES.2011.6156695