Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor

Akihiro Kojima; Yoshiaki Shimooka; Yoshiaki Sugizaki; Mitsuyoshi Endo; Hiroaki Yamazaki; Etsuji Ogawa; Tamio Ikehashi; Tatsuya Ohguro; Susumu Obata; Takeshi Miyagi; Ikuo Mori; Yoshiaki Toyoshima; Hideki Shibata

doi:10.1109/SENSOR.2009.5285778

Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor

Akihiro Kojima, Yoshiaki Shimooka, Yoshiaki Sugizaki, Mitsuyoshi Endo, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi, Tatsuya Ohguro, Susumu Obata, Takeshi Miyagi, Ikuo Mori, Yoshiaki Toyoshima, Hideki Shibata

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

In this paper, we report a thin-film encapsulation technology for wafer-level micro-electro-mechanical systems (MEMS) variable capacitor package. The electrical characteristics of MEMS are adversely affected by moisture. In order to prevent moisture from permeating into a package, the top surface was protected with a plasma-enhanced chemical vapor deposition (PE-CVD) SiN layer. The developed packages become a hybrid thin-film hermetic encapsulation consisting of an internal shell using PE-CVD SiO, a seal layer coating with resin, and an external protective layer formed by PE-CVD SiN. The process is fully compatible with standard low-cost back-end-of-the-line (BEOL) technologies for LSIs as a wafer-level package (WLP). This hybrid structure was very effective for protecting the MEMS device from external moisture. Moreover, the electrode surface area has to be wide, because a wide range of capacities is necessary in MEMS variable capacitors. We have developed a large (1480 × 1080 μm) hermetic thin-film encapsulation as WLP.

Original language	English
Title of host publication	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages	837-840
Number of pages	4
DOIs	https://doi.org/10.1109/SENSOR.2009.5285778
Publication status	Published - 2009 Dec 11
Externally published	Yes
Event	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States Duration: 2009 Jun 21 → 2009 Jun 25

Publication series

Name	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

Conference	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Country	United States
City	Denver, CO
Period	09/6/21 → 09/6/25

Keywords

Hermetic encapsulation
Stiction
Wafer-level package (WLP)

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/SENSOR.2009.5285778

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Kojima, A., Shimooka, Y., Sugizaki, Y., Endo, M., Yamazaki, H., Ogawa, E., Ikehashi, T., Ohguro, T., Obata, S., Miyagi, T., Mori, I., Toyoshima, Y., & Shibata, H. (2009). Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 837-840). [5285778] (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285778

Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. / Kojima, Akihiro; Shimooka, Yoshiaki; Sugizaki, Yoshiaki; Endo, Mitsuyoshi; Yamazaki, Hiroaki; Ogawa, Etsuji; Ikehashi, Tamio; Ohguro, Tatsuya; Obata, Susumu; Miyagi, Takeshi; Mori, Ikuo; Toyoshima, Yoshiaki; Shibata, Hideki.

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 837-840 5285778 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kojima, A, Shimooka, Y, Sugizaki, Y, Endo, M, Yamazaki, H, Ogawa, E, Ikehashi, T, Ohguro, T, Obata, S, Miyagi, T, Mori, I, Toyoshima, Y & Shibata, H 2009, Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. in TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems., 5285778, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 837-840, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, United States, 09/6/21. https://doi.org/10.1109/SENSOR.2009.5285778

Kojima A, Shimooka Y, Sugizaki Y, Endo M, Yamazaki H, Ogawa E et al. Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 837-840. 5285778. (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285778

Kojima, Akihiro ; Shimooka, Yoshiaki ; Sugizaki, Yoshiaki ; Endo, Mitsuyoshi ; Yamazaki, Hiroaki ; Ogawa, Etsuji ; Ikehashi, Tamio ; Ohguro, Tatsuya ; Obata, Susumu ; Miyagi, Takeshi ; Mori, Ikuo ; Toyoshima, Yoshiaki ; Shibata, Hideki. / Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. pp. 837-840 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

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AU - Yamazaki, Hiroaki

AU - Ogawa, Etsuji

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AB - In this paper, we report a thin-film encapsulation technology for wafer-level micro-electro-mechanical systems (MEMS) variable capacitor package. The electrical characteristics of MEMS are adversely affected by moisture. In order to prevent moisture from permeating into a package, the top surface was protected with a plasma-enhanced chemical vapor deposition (PE-CVD) SiN layer. The developed packages become a hybrid thin-film hermetic encapsulation consisting of an internal shell using PE-CVD SiO, a seal layer coating with resin, and an external protective layer formed by PE-CVD SiN. The process is fully compatible with standard low-cost back-end-of-the-line (BEOL) technologies for LSIs as a wafer-level package (WLP). This hybrid structure was very effective for protecting the MEMS device from external moisture. Moreover, the electrode surface area has to be wide, because a wide range of capacities is necessary in MEMS variable capacitors. We have developed a large (1480 × 1080 μm) hermetic thin-film encapsulation as WLP.

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