Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor

Akihiro Kojima, Yoshiaki Shimooka, Yoshiaki Sugizaki, Mitsuyoshi Endo, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi, Tatsuya Ohguro, Susumu Obata, Takeshi Miyagi, Ikuo Mori, Yoshiaki Toyoshima, Hideki Shibata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this paper, we report a thin-film encapsulation technology for wafer-level micro-electro-mechanical systems (MEMS) variable capacitor package. The electrical characteristics of MEMS are adversely affected by moisture. In order to prevent moisture from permeating into a package, the top surface was protected with a plasma-enhanced chemical vapor deposition (PE-CVD) SiN layer. The developed packages become a hybrid thin-film hermetic encapsulation consisting of an internal shell using PE-CVD SiO, a seal layer coating with resin, and an external protective layer formed by PE-CVD SiN. The process is fully compatible with standard low-cost back-end-of-the-line (BEOL) technologies for LSIs as a wafer-level package (WLP). This hybrid structure was very effective for protecting the MEMS device from external moisture. Moreover, the electrode surface area has to be wide, because a wide range of capacities is necessary in MEMS variable capacitors. We have developed a large (1480 × 1080 μm) hermetic thin-film encapsulation as WLP.

Original languageEnglish
Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages837-840
Number of pages4
DOIs
Publication statusPublished - 2009 Dec 11
Externally publishedYes
EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
Duration: 2009 Jun 212009 Jun 25

Publication series

NameTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

ConferenceTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
CountryUnited States
CityDenver, CO
Period09/6/2109/6/25

Keywords

  • Hermetic encapsulation
  • Stiction
  • Wafer-level package (WLP)

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor'. Together they form a unique fingerprint.

  • Cite this

    Kojima, A., Shimooka, Y., Sugizaki, Y., Endo, M., Yamazaki, H., Ogawa, E., Ikehashi, T., Ohguro, T., Obata, S., Miyagi, T., Mori, I., Toyoshima, Y., & Shibata, H. (2009). Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 837-840). [5285778] (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285778