Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor

Akihiro Kojima*, Yoshiaki Shimooka, Yoshiaki Sugizaki, Mitsuyoshi Endo, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi, Tatsuya Ohguro, Susumu Obata, Takeshi Miyagi, Ikuo Mori, Yoshiaki Toyoshima, Hideki Shibata

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this paper, we report a thin-film encapsulation technology for wafer-level micro-electro-mechanical systems (MEMS) variable capacitor package. The electrical characteristics of MEMS are adversely affected by moisture. In order to prevent moisture from permeating into a package, the top surface was protected with a plasma-enhanced chemical vapor deposition (PE-CVD) SiN layer. The developed packages become a hybrid thin-film hermetic encapsulation consisting of an internal shell using PE-CVD SiO, a seal layer coating with resin, and an external protective layer formed by PE-CVD SiN. The process is fully compatible with standard low-cost back-end-of-the-line (BEOL) technologies for LSIs as a wafer-level package (WLP). This hybrid structure was very effective for protecting the MEMS device from external moisture. Moreover, the electrode surface area has to be wide, because a wide range of capacities is necessary in MEMS variable capacitors. We have developed a large (1480 × 1080 μm) hermetic thin-film encapsulation as WLP.

Original languageEnglish
Title of host publicationTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages837-840
Number of pages4
DOIs
Publication statusPublished - 2009 Dec 11
Externally publishedYes
EventTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
Duration: 2009 Jun 212009 Jun 25

Publication series

NameTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

ConferenceTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Country/TerritoryUnited States
CityDenver, CO
Period09/6/2109/6/25

Keywords

  • Hermetic encapsulation
  • Stiction
  • Wafer-level package (WLP)

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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