Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor

Akihiro Kojima; Yoshiaki Shimooka; Yoshiaki Sugizaki; Mitsuyoshi Endo; Hiroaki Yamazaki; Etsuji Ogawa; Tamio Ikehashi; Tatsuya Ohguro; Susumu Obata; Takeshi Miyagi; Ikuo Mori; Yoshiaki Toyoshima; Hideki Shibata

doi:10.1109/SENSOR.2009.5285778

Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor

Akihiro Kojima^*, Yoshiaki Shimooka, Yoshiaki Sugizaki, Mitsuyoshi Endo, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi, Tatsuya Ohguro, Susumu Obata, Takeshi Miyagi, Ikuo Mori, Yoshiaki Toyoshima, Hideki Shibata

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

In this paper, we report a thin-film encapsulation technology for wafer-level micro-electro-mechanical systems (MEMS) variable capacitor package. The electrical characteristics of MEMS are adversely affected by moisture. In order to prevent moisture from permeating into a package, the top surface was protected with a plasma-enhanced chemical vapor deposition (PE-CVD) SiN layer. The developed packages become a hybrid thin-film hermetic encapsulation consisting of an internal shell using PE-CVD SiO, a seal layer coating with resin, and an external protective layer formed by PE-CVD SiN. The process is fully compatible with standard low-cost back-end-of-the-line (BEOL) technologies for LSIs as a wafer-level package (WLP). This hybrid structure was very effective for protecting the MEMS device from external moisture. Moreover, the electrode surface area has to be wide, because a wide range of capacities is necessary in MEMS variable capacitors. We have developed a large (1480 × 1080 μm) hermetic thin-film encapsulation as WLP.

Original language	English
Title of host publication	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages	837-840
Number of pages	4
DOIs	https://doi.org/10.1109/SENSOR.2009.5285778
Publication status	Published - 2009 Dec 11
Externally published	Yes
Event	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States Duration: 2009 Jun 21 → 2009 Jun 25

Publication series

Name	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

Conference	TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
Country/Territory	United States
City	Denver, CO
Period	09/6/21 → 09/6/25

Keywords

Hermetic encapsulation
Stiction
Wafer-level package (WLP)

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/SENSOR.2009.5285778

Cite this

Kojima, A., Shimooka, Y., Sugizaki, Y., Endo, M., Yamazaki, H., Ogawa, E., Ikehashi, T., Ohguro, T., Obata, S., Miyagi, T., Mori, I., Toyoshima, Y., & Shibata, H. (2009). Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 837-840). [5285778] (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285778

Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. / Kojima, Akihiro; Shimooka, Yoshiaki; Sugizaki, Yoshiaki; Endo, Mitsuyoshi; Yamazaki, Hiroaki; Ogawa, Etsuji; Ikehashi, Tamio; Ohguro, Tatsuya; Obata, Susumu; Miyagi, Takeshi; Mori, Ikuo; Toyoshima, Yoshiaki; Shibata, Hideki.

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 837-840 5285778 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kojima, A, Shimooka, Y, Sugizaki, Y, Endo, M, Yamazaki, H, Ogawa, E, Ikehashi, T, Ohguro, T, Obata, S, Miyagi, T, Mori, I, Toyoshima, Y & Shibata, H 2009, Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. in TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems., 5285778, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 837-840, TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, United States, 09/6/21. https://doi.org/10.1109/SENSOR.2009.5285778

Kojima A, Shimooka Y, Sugizaki Y, Endo M, Yamazaki H, Ogawa E et al. Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. In TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. p. 837-840. 5285778. (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285778

Kojima, Akihiro ; Shimooka, Yoshiaki ; Sugizaki, Yoshiaki ; Endo, Mitsuyoshi ; Yamazaki, Hiroaki ; Ogawa, Etsuji ; Ikehashi, Tamio ; Ohguro, Tatsuya ; Obata, Susumu ; Miyagi, Takeshi ; Mori, Ikuo ; Toyoshima, Yoshiaki ; Shibata, Hideki. / Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems. 2009. pp. 837-840 (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems).

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AU - Yamazaki, Hiroaki

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AB - In this paper, we report a thin-film encapsulation technology for wafer-level micro-electro-mechanical systems (MEMS) variable capacitor package. The electrical characteristics of MEMS are adversely affected by moisture. In order to prevent moisture from permeating into a package, the top surface was protected with a plasma-enhanced chemical vapor deposition (PE-CVD) SiN layer. The developed packages become a hybrid thin-film hermetic encapsulation consisting of an internal shell using PE-CVD SiO, a seal layer coating with resin, and an external protective layer formed by PE-CVD SiN. The process is fully compatible with standard low-cost back-end-of-the-line (BEOL) technologies for LSIs as a wafer-level package (WLP). This hybrid structure was very effective for protecting the MEMS device from external moisture. Moreover, the electrode surface area has to be wide, because a wide range of capacities is necessary in MEMS variable capacitors. We have developed a large (1480 × 1080 μm) hermetic thin-film encapsulation as WLP.

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Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor

Abstract

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Conference

Keywords

ASJC Scopus subject areas

Access to Document

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