How different fillers affect the thermal conductivity of epoxy composites

I. A. Tsekmes, R. Kochetov, P. H F Morshuis, J. J. Smit, Tomonori Iizuka, Kohei Tatsumi, T. Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The low thermal conductivity of polymers can be improved with the incorporation of fillers with a relatively high thermal conductivity. However, the improvement which can be achieved depends not only on the filler properties but also on the interaction between the polymer matrix and fillers. In this study, a variety of polymer composites with surface modified particles were synthesized. Hexagonal boron nitride-, cubic boron nitride-and silica-epoxy composites were produced and their thermal conductivity was determined with the use of the transient plane source method. The results on the composite thermal conductivity suggest that the interaction between epoxy and fillers is one of the most important parameters. A better interaction results in the suppression of phonon scattering at the numerous interfaces and thus, in a higher composite thermal conductivity. Also, filler size can affect the performance of the polymer composites. The decrease of the filler size significantly increases the surface-to-volume ratio which in turn increases the phonon scattering at the interfaces. Finally, it seems that the intrinsic thermal conductivity of fillers slightly contributes to the thermal conductivity of composites especially when the filler size is smaller than 100 nm.

Original languageEnglish
Title of host publication2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages647-650
Number of pages4
ISBN (Print)9781479975235
DOIs
Publication statusPublished - 2014 Dec 22
Event2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 - Des Moines, United States
Duration: 2014 Oct 192014 Oct 22

Other

Other2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
CountryUnited States
CityDes Moines
Period14/10/1914/10/22

Fingerprint

Fillers
Thermal conductivity
Composite materials
Phonon scattering
Polymers
Cubic boron nitride
Boron nitride
Polymer matrix
Silica

Keywords

  • epoxy composites
  • interaction between matrix and fillers
  • particle size
  • thermal conductivity

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Tsekmes, I. A., Kochetov, R., Morshuis, P. H. F., Smit, J. J., Iizuka, T., Tatsumi, K., & Tanaka, T. (2014). How different fillers affect the thermal conductivity of epoxy composites. In 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 (pp. 647-650). [6995843] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP.2014.6995843

How different fillers affect the thermal conductivity of epoxy composites. / Tsekmes, I. A.; Kochetov, R.; Morshuis, P. H F; Smit, J. J.; Iizuka, Tomonori; Tatsumi, Kohei; Tanaka, T.

2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 647-650 6995843.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tsekmes, IA, Kochetov, R, Morshuis, PHF, Smit, JJ, Iizuka, T, Tatsumi, K & Tanaka, T 2014, How different fillers affect the thermal conductivity of epoxy composites. in 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014., 6995843, Institute of Electrical and Electronics Engineers Inc., pp. 647-650, 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014, Des Moines, United States, 14/10/19. https://doi.org/10.1109/CEIDP.2014.6995843
Tsekmes IA, Kochetov R, Morshuis PHF, Smit JJ, Iizuka T, Tatsumi K et al. How different fillers affect the thermal conductivity of epoxy composites. In 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 647-650. 6995843 https://doi.org/10.1109/CEIDP.2014.6995843
Tsekmes, I. A. ; Kochetov, R. ; Morshuis, P. H F ; Smit, J. J. ; Iizuka, Tomonori ; Tatsumi, Kohei ; Tanaka, T. / How different fillers affect the thermal conductivity of epoxy composites. 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 647-650
@inproceedings{8a701c3a59734cb4be4e92601f9a058c,
title = "How different fillers affect the thermal conductivity of epoxy composites",
abstract = "The low thermal conductivity of polymers can be improved with the incorporation of fillers with a relatively high thermal conductivity. However, the improvement which can be achieved depends not only on the filler properties but also on the interaction between the polymer matrix and fillers. In this study, a variety of polymer composites with surface modified particles were synthesized. Hexagonal boron nitride-, cubic boron nitride-and silica-epoxy composites were produced and their thermal conductivity was determined with the use of the transient plane source method. The results on the composite thermal conductivity suggest that the interaction between epoxy and fillers is one of the most important parameters. A better interaction results in the suppression of phonon scattering at the numerous interfaces and thus, in a higher composite thermal conductivity. Also, filler size can affect the performance of the polymer composites. The decrease of the filler size significantly increases the surface-to-volume ratio which in turn increases the phonon scattering at the interfaces. Finally, it seems that the intrinsic thermal conductivity of fillers slightly contributes to the thermal conductivity of composites especially when the filler size is smaller than 100 nm.",
keywords = "epoxy composites, interaction between matrix and fillers, particle size, thermal conductivity",
author = "Tsekmes, {I. A.} and R. Kochetov and Morshuis, {P. H F} and Smit, {J. J.} and Tomonori Iizuka and Kohei Tatsumi and T. Tanaka",
year = "2014",
month = "12",
day = "22",
doi = "10.1109/CEIDP.2014.6995843",
language = "English",
isbn = "9781479975235",
pages = "647--650",
booktitle = "2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - How different fillers affect the thermal conductivity of epoxy composites

AU - Tsekmes, I. A.

AU - Kochetov, R.

AU - Morshuis, P. H F

AU - Smit, J. J.

AU - Iizuka, Tomonori

AU - Tatsumi, Kohei

AU - Tanaka, T.

PY - 2014/12/22

Y1 - 2014/12/22

N2 - The low thermal conductivity of polymers can be improved with the incorporation of fillers with a relatively high thermal conductivity. However, the improvement which can be achieved depends not only on the filler properties but also on the interaction between the polymer matrix and fillers. In this study, a variety of polymer composites with surface modified particles were synthesized. Hexagonal boron nitride-, cubic boron nitride-and silica-epoxy composites were produced and their thermal conductivity was determined with the use of the transient plane source method. The results on the composite thermal conductivity suggest that the interaction between epoxy and fillers is one of the most important parameters. A better interaction results in the suppression of phonon scattering at the numerous interfaces and thus, in a higher composite thermal conductivity. Also, filler size can affect the performance of the polymer composites. The decrease of the filler size significantly increases the surface-to-volume ratio which in turn increases the phonon scattering at the interfaces. Finally, it seems that the intrinsic thermal conductivity of fillers slightly contributes to the thermal conductivity of composites especially when the filler size is smaller than 100 nm.

AB - The low thermal conductivity of polymers can be improved with the incorporation of fillers with a relatively high thermal conductivity. However, the improvement which can be achieved depends not only on the filler properties but also on the interaction between the polymer matrix and fillers. In this study, a variety of polymer composites with surface modified particles were synthesized. Hexagonal boron nitride-, cubic boron nitride-and silica-epoxy composites were produced and their thermal conductivity was determined with the use of the transient plane source method. The results on the composite thermal conductivity suggest that the interaction between epoxy and fillers is one of the most important parameters. A better interaction results in the suppression of phonon scattering at the numerous interfaces and thus, in a higher composite thermal conductivity. Also, filler size can affect the performance of the polymer composites. The decrease of the filler size significantly increases the surface-to-volume ratio which in turn increases the phonon scattering at the interfaces. Finally, it seems that the intrinsic thermal conductivity of fillers slightly contributes to the thermal conductivity of composites especially when the filler size is smaller than 100 nm.

KW - epoxy composites

KW - interaction between matrix and fillers

KW - particle size

KW - thermal conductivity

UR - http://www.scopus.com/inward/record.url?scp=84936806670&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84936806670&partnerID=8YFLogxK

U2 - 10.1109/CEIDP.2014.6995843

DO - 10.1109/CEIDP.2014.6995843

M3 - Conference contribution

AN - SCOPUS:84936806670

SN - 9781479975235

SP - 647

EP - 650

BT - 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014

PB - Institute of Electrical and Electronics Engineers Inc.

ER -