Hybrid Au-Au bonding technology using planar adhesive structure for 3D integration

Masatsugu Nimura, Jun Mizuno, Akitsu Shigetou, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science