Hybrid Au-underfill resin bonding with lock-and-key structure

Masatsugu Nimura, Akitsu Shigetou, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Jun Mizuno, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

We developed a novel hybrid bonding technology for Au ultralow-profiled bumps and underfill resin with a modified "lock-and-key structure." The lock structure interlocks with the key structure. We applied these structures to perform an entire adhesion between the mating surfaces in place of conventional underfilling technique. To fabricate the key structure, we developed a simple process that can remove resin on the bumps. Lock structure was fabricated by photolithography and dry etching. After the bonding was carried out, the bonded interface was observed with a Scanning Electron Microscope (SEM), a transmission electron microscope (TEM) and a Scanning Acoustic Microscope (SAM). The results proved that no significant gap was existed at both Au-Au and resin-resin interface. Furthermore, the shear strength of the bonded sample with resin was ten times stronger than that without resin. The conduction of Au bump connections after hybrid bonding was also confirmed.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages258-262
Number of pages5
DOIs
Publication statusPublished - 2012
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA
Duration: 2012 May 292012 Jun 1

Other

Other2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
CitySan Diego, CA
Period12/5/2912/6/1

Fingerprint

Resins
Electron microscopes
Acoustic microscopes
Scanning
Dry etching
Photolithography
Shear strength
Adhesion

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Nimura, M., Shigetou, A., Sakuma, K., Ogino, H., Enomoto, T., Mizuno, J., & Shoji, S. (2012). Hybrid Au-underfill resin bonding with lock-and-key structure. In Proceedings - Electronic Components and Technology Conference (pp. 258-262). [6248837] https://doi.org/10.1109/ECTC.2012.6248837

Hybrid Au-underfill resin bonding with lock-and-key structure. / Nimura, Masatsugu; Shigetou, Akitsu; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Mizuno, Jun; Shoji, Shuichi.

Proceedings - Electronic Components and Technology Conference. 2012. p. 258-262 6248837.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nimura, M, Shigetou, A, Sakuma, K, Ogino, H, Enomoto, T, Mizuno, J & Shoji, S 2012, Hybrid Au-underfill resin bonding with lock-and-key structure. in Proceedings - Electronic Components and Technology Conference., 6248837, pp. 258-262, 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012, San Diego, CA, 12/5/29. https://doi.org/10.1109/ECTC.2012.6248837
Nimura M, Shigetou A, Sakuma K, Ogino H, Enomoto T, Mizuno J et al. Hybrid Au-underfill resin bonding with lock-and-key structure. In Proceedings - Electronic Components and Technology Conference. 2012. p. 258-262. 6248837 https://doi.org/10.1109/ECTC.2012.6248837
Nimura, Masatsugu ; Shigetou, Akitsu ; Sakuma, Katsuyuki ; Ogino, Hiroshi ; Enomoto, Tomoyuki ; Mizuno, Jun ; Shoji, Shuichi. / Hybrid Au-underfill resin bonding with lock-and-key structure. Proceedings - Electronic Components and Technology Conference. 2012. pp. 258-262
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