Hybrid Au-underfill resin bonding with lock-and-key structure

Masatsugu Nimura*, Akitsu Shigetou, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Jun Mizuno, Shuichi Shoji

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds