Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Mamoru Tamura, Tomoyuki Enomoto, Akitsu Shigetou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds