Hybrid film for self-adhesion and shape-controlling

Sota Shimbo; Toshinori Fujie; Eiji Iwase

doi:10.1109/MEMSYS.2017.7863485

Hybrid film for self-adhesion and shape-controlling

Sota Shimbo, Toshinori Fujie, Eiji Iwase

Waseda Institute for Advanced Study

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

We report a hybrid film that is composed of 'polymer nanosheet' with a hundreds-of-nanometer-thick film and 'punched film' with hundreds-of-micrometer-thick film. Because of the thickness, the nanosheet is able to adhere to biological tissues without a glue, but is sometimes difficult to handling. Our hybrid film is established both adhesiveness of the nanosheet and shape-controlling ability of the punched film. In this paper, first, we fabricated the cylindrical-shaped hybrid film. Next, we achieved the hybrid film unfold into flat shape. Finally, we evaluated the adhesion force of the hybrid film and confirmed that the hybrid film can adhere to biological tissues.

Original language	English
Title of host publication	2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	624-627
Number of pages	4
ISBN (Electronic)	9781509050789
DOIs	https://doi.org/10.1109/MEMSYS.2017.7863485
Publication status	Published - 2017 Feb 23
Event	30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States Duration: 2017 Jan 22 → 2017 Jan 26

Other

Other	30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Country	United States
City	Las Vegas
Period	17/1/22 → 17/1/26

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

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10.1109/MEMSYS.2017.7863485

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Cite this

Shimbo, S, Fujie, T & Iwase, E 2017, Hybrid film for self-adhesion and shape-controlling. in 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017., 7863485, Institute of Electrical and Electronics Engineers Inc., pp. 624-627, 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017, Las Vegas, United States, 17/1/22. https://doi.org/10.1109/MEMSYS.2017.7863485

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