Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding

R. Takigawa, E. Higurashi, T. Suga, Tetsuya Kawanishi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Hybrid integration of high-quality lithium niobate (LiNbO 3) single-crystal thin films (<5 μm) on micromachined Si substrates has been demonstrated using room-temperature flip-chip transfer bonding based on surface-activated bonding with Au microbumps.

Original languageEnglish
Title of host publicationProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Pages105
Number of pages1
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan
Duration: 2012 May 222012 May 23

Other

Other2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
CountryJapan
CityTokyo
Period12/5/2212/5/23

Fingerprint

Thin films
Substrates
Lithium
Single crystals
Temperature

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition

Cite this

Takigawa, R., Higurashi, E., Suga, T., & Kawanishi, T. (2012). Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 (pp. 105). [6238064] https://doi.org/10.1109/LTB-3D.2012.6238064

Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding. / Takigawa, R.; Higurashi, E.; Suga, T.; Kawanishi, Tetsuya.

Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 105 6238064.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Takigawa, R, Higurashi, E, Suga, T & Kawanishi, T 2012, Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238064, pp. 105, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, Japan, 12/5/22. https://doi.org/10.1109/LTB-3D.2012.6238064
Takigawa R, Higurashi E, Suga T, Kawanishi T. Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 105. 6238064 https://doi.org/10.1109/LTB-3D.2012.6238064
Takigawa, R. ; Higurashi, E. ; Suga, T. ; Kawanishi, Tetsuya. / Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding. Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. pp. 105
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