Image formation by dynamic exposure with multispot beam in X-ray nanolithography

Eijiro Toyota, Masakazu Washio

    Research output: Contribution to journalArticle

    3 Citations (Scopus)

    Abstract

    We propose here a new method in X-ray nanolithography. Using this method, two-dimensional patterns with a linewidth of 25 nm can be formed. A conventional proximity X-ray lithography system is applicable to the method with a practical gap of approximately 8 μm. A 2X mask is used in the method instead of a 1X mask, changing the mask-wafer position (not gap) during exposure. The mask forms multispot images on the wafer; thus the traces of the relative change of the mask-wafer position during exposure ('dynamic exposure') produce a periodic pattern. The image formability and operational productivity for three kinds of 2X masks proposed for application to this method are described.

    Original languageEnglish
    Pages (from-to)4404-4409
    Number of pages6
    JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
    Volume41
    Issue number6 B
    Publication statusPublished - 2002 Jun

    Fingerprint

    Nanolithography
    Masks
    Image processing
    masks
    X rays
    x rays
    wafers
    X ray lithography
    Formability
    productivity
    Linewidth
    proximity
    lithography
    Productivity

    Keywords

    • Dynamic exposure
    • Enlarged pattern mask
    • Focusing X-ray mask
    • Interference slit mask
    • X-ray lithography
    • X-ray mask

    ASJC Scopus subject areas

    • Physics and Astronomy (miscellaneous)

    Cite this

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    abstract = "We propose here a new method in X-ray nanolithography. Using this method, two-dimensional patterns with a linewidth of 25 nm can be formed. A conventional proximity X-ray lithography system is applicable to the method with a practical gap of approximately 8 μm. A 2X mask is used in the method instead of a 1X mask, changing the mask-wafer position (not gap) during exposure. The mask forms multispot images on the wafer; thus the traces of the relative change of the mask-wafer position during exposure ('dynamic exposure') produce a periodic pattern. The image formability and operational productivity for three kinds of 2X masks proposed for application to this method are described.",
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