IMC growth of solid state reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag solder bump using ball place bumping method during aging

Shinji Ishikawa, Eiji Hashino, Taro Kono, Kohei Tatsumi

Research output: Contribution to journal › Article › peer-review

19 Citations (Scopus)

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