Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers

Q. Xie, Yoshimichi Ohki, Naoshi Hirai, Y. H. Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Nano-sized magnesium oxide or magnesia has been reported to be useful for suppressing the space charge accumulation when it is added in epoxy resin. However, the addition of nano-magnesia to epoxy resin decreases the glass transition temperature (Tg) signficantly, which may limit industrial applications of magnesia/epoxy nanocomposites. In this work, nanomagnesia particles with an average size of 52 nm and micro-magnesia with an average size of 3.1 pm were mixed in a commercially available bisphenol-A epoxy resin. The weight ratio of nano- and micro-fillers in each composite was changed, while the total content of the two fillers was fixed at 5 weight%. As a result, it has become clear that the addition of micro-sized magnesia fillers to magnesia/epoxy nanocomposites recovers Tg back to its original high temperature. Then, a dc electric field of 30 kV/mm was applied to the samples for 20 minutes at various temperatures from 40 to 200 °C and space charge distributions were measured by the pulsed electro-Acoustic method. The results show that space charge accumulates in both vicinities of the cathode and the anode with the same polarities as those of the nearby electrodes when the temperature is 80 °C or below. However, space charges become hetero and are observed only in the vicinity of the cathode at 140 °C and above. These homocharges and heterocharges become very small when the weight content of nano-sized fillers increases, which is industrially very important. Both complex dielectric permittivity and electrical conductivity also decrease with the increase in the content of nanofillers.

Original languageEnglish
Title of host publication2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509042784
DOIs
Publication statusPublished - 2017 May 31
Event2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017 - Delft, Netherlands
Duration: 2017 Apr 52017 Apr 7

Other

Other2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017
CountryNetherlands
CityDelft
Period17/4/517/4/7

Fingerprint

Magnesium Oxide
Epoxy Resins
Magnesia
Epoxy resins
Dielectric properties
Fillers
Electric space charge
Composite materials
Temperature
Nanocomposites
Cathodes
Charge distribution
Industrial applications
Anodes
Permittivity
Acoustics
Electric fields
Electrodes

Keywords

  • dielectric peroperty
  • epoxy resin
  • magnesium oxide
  • microcomposite
  • nanocamposite
  • space charge

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

Cite this

Xie, Q., Ohki, Y., Hirai, N., & Cheng, Y. H. (2017). Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers. In 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017 [7936745] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IWIPP.2017.7936745

Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers. / Xie, Q.; Ohki, Yoshimichi; Hirai, Naoshi; Cheng, Y. H.

2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7936745.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Xie, Q, Ohki, Y, Hirai, N & Cheng, YH 2017, Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers. in 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017., 7936745, Institute of Electrical and Electronics Engineers Inc., 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017, Delft, Netherlands, 17/4/5. https://doi.org/10.1109/IWIPP.2017.7936745
Xie Q, Ohki Y, Hirai N, Cheng YH. Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers. In 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 7936745 https://doi.org/10.1109/IWIPP.2017.7936745
Xie, Q. ; Ohki, Yoshimichi ; Hirai, Naoshi ; Cheng, Y. H. / Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers. 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017. Institute of Electrical and Electronics Engineers Inc., 2017.
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