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Improved MEMS structure for stress-free flip-chip packaging
Jinxing Liang
*
, Toshitsugu Ueda
*
Corresponding author for this work
Research output
:
Contribution to journal
›
Article
›
peer-review
2
Citations (Scopus)
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Physics & Astronomy
packaging
79%
microelectromechanical systems
72%
chips
59%
residual stress
46%
thermal cycling tests
20%
fatigue life
16%
solders
14%
melting points
11%
integrated circuits
11%
deflection
11%
quartz
10%
thermal expansion
10%
capacitance
10%
wafers
9%
evaluation
7%
electrodes
7%
sensors
7%
microstructure
7%
sensitivity
7%
coefficients
6%
performance
5%
Engineering & Materials Science
MEMS
69%
Packaging
67%
Residual stresses
43%
Capacitive sensors
15%
Thermal cycling
14%
Encapsulation
14%
Quartz
13%
Melting point
13%
Thermal expansion
12%
Soldering alloys
12%
Integrated circuits
11%
Capacitance
10%
Electrodes
9%
Substrates
8%
Fatigue of materials
8%
Microstructure
8%
Chemical Compounds
Residual Stress
100%
Packaging Process
32%
Thermal Cycling
23%
Solder
23%
Thermal Expansion
20%
Quartz
16%
Encapsulation
16%
Melting Point
15%
Alloy
13%
Microstructure
12%
Behavior as Electrode
9%