TY - GEN
T1 - Improved method for evaluation of dielectric breakdown strength of epoxy / silica nanocomposite thin films
AU - Kida, Yusuke
AU - Sankawa, Rina
AU - Takahashi, Kohei
AU - Yamamoto, Shuhei
AU - Watanabe, Takanobu
AU - Mura, Kotaro
AU - Ohgashi, Yoshihiro
AU - Yoshimitsu, Tetsuo
AU - Imai, Takahiro
N1 - Publisher Copyright:
© 2020 Institute of Electrical Engineers of Japan. All rights reserved.
PY - 2020/9/13
Y1 - 2020/9/13
N2 - Epoxy / silica nanocomposite materials are attracting attention as a promising insulating material for next-generation electric rotating machines. It is empirically known the dielectric breakdown strength of an organic insulating material can be improved by mixing with nano-scale inorganic fillers. However, the role of the inorganic filler in the suppression of the dielectric breakdown is not fully understood yet. In this study, we are developing an efficient method for characterizing dielectric breakdown strength of epoxy / silica nanocomposite material, where the epoxy resin sample is thinned to sub-micrometer scale to induce the breakdown even at a low voltage and in a short time. The problem with using thin epoxy resin is its fragility; the thin epoxy resin is easily damaged by sticking an electrical probe on it. This problem is resolved by depositing a buffer metal layer on the epoxy resin and employing a metal bead as the electrical probe. It is confirmed by SEM observation that the damage at evaluated point on the epoxy resin is successfully suppressed. Using the bead probe, we successfully monitored the current transition of the dielectric breakdown events.
AB - Epoxy / silica nanocomposite materials are attracting attention as a promising insulating material for next-generation electric rotating machines. It is empirically known the dielectric breakdown strength of an organic insulating material can be improved by mixing with nano-scale inorganic fillers. However, the role of the inorganic filler in the suppression of the dielectric breakdown is not fully understood yet. In this study, we are developing an efficient method for characterizing dielectric breakdown strength of epoxy / silica nanocomposite material, where the epoxy resin sample is thinned to sub-micrometer scale to induce the breakdown even at a low voltage and in a short time. The problem with using thin epoxy resin is its fragility; the thin epoxy resin is easily damaged by sticking an electrical probe on it. This problem is resolved by depositing a buffer metal layer on the epoxy resin and employing a metal bead as the electrical probe. It is confirmed by SEM observation that the damage at evaluated point on the epoxy resin is successfully suppressed. Using the bead probe, we successfully monitored the current transition of the dielectric breakdown events.
KW - Dielectric Breakdown
KW - Epoxy
KW - Nano-composite
KW - Scanning Electron Microscope (SEM)
KW - Silica
KW - Thin film
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M3 - Conference contribution
AN - SCOPUS:85099314278
T3 - Proceedings of the International Symposium on Electrical Insulating Materials
SP - 297
EP - 300
BT - Proceedings of 2020 International Symposium on Electrical Insulating Materials, ISEIM 2020
PB - Institute of Electrical Engineers of Japan
T2 - 2020 International Symposium on Electrical Insulating Materials, ISEIM 2020
Y2 - 13 September 2020 through 17 September 2020
ER -