Improved method for evaluation of dielectric breakdown strength of epoxy / silica nanocomposite thin films

Yusuke Kida, Rina Sankawa, Kohei Takahashi, Shuhei Yamamoto, Takanobu Watanabe, Kotaro Mura, Yoshihiro Ohgashi, Tetsuo Yoshimitsu, Takahiro Imai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Epoxy / silica nanocomposite materials are attracting attention as a promising insulating material for next-generation electric rotating machines. It is empirically known the dielectric breakdown strength of an organic insulating material can be improved by mixing with nano-scale inorganic fillers. However, the role of the inorganic filler in the suppression of the dielectric breakdown is not fully understood yet. In this study, we are developing an efficient method for characterizing dielectric breakdown strength of epoxy / silica nanocomposite material, where the epoxy resin sample is thinned to sub-micrometer scale to induce the breakdown even at a low voltage and in a short time. The problem with using thin epoxy resin is its fragility; the thin epoxy resin is easily damaged by sticking an electrical probe on it. This problem is resolved by depositing a buffer metal layer on the epoxy resin and employing a metal bead as the electrical probe. It is confirmed by SEM observation that the damage at evaluated point on the epoxy resin is successfully suppressed. Using the bead probe, we successfully monitored the current transition of the dielectric breakdown events.

Original languageEnglish
Title of host publicationProceedings of 2020 International Symposium on Electrical Insulating Materials, ISEIM 2020
PublisherInstitute of Electrical Engineers of Japan
Pages297-300
Number of pages4
ISBN (Electronic)9784886864185
Publication statusPublished - 2020 Sep 13
Event2020 International Symposium on Electrical Insulating Materials, ISEIM 2020 - Virtual, Tokyo, Japan
Duration: 2020 Sep 132020 Sep 17

Publication series

NameProceedings of the International Symposium on Electrical Insulating Materials
Volume2020-September

Conference

Conference2020 International Symposium on Electrical Insulating Materials, ISEIM 2020
CountryJapan
CityVirtual, Tokyo
Period20/9/1320/9/17

Keywords

  • Dielectric Breakdown
  • Epoxy
  • Nano-composite
  • Scanning Electron Microscope (SEM)
  • Silica
  • Thin film

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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