Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica

Mayumi Hyuga, Naoki Tagami, Toshikatsu Tanaka, Yoshimichi Ohki, Takahiro Imai, Miyuki Harada, Mitsukazu Ochi

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Effects of addition of micro-sized silica fillers and/or nano-sized clay fillers into epoxy resin on its dielectric properties were examined. The glass transition intermediate temperature (Tg) was found to show a decrease by the addition of a small amount of nanofillers, while it is increased by the addition of abundant microfillers with and without co-addition of a small amount of nanofillers. At temperatures above Tg, the samples with abundant microfillers were added have low conductivity, low dielectric constant, and low dielectric loss factor regardless of the co-addition of nanofillers.

    Original languageEnglish
    Title of host publicationAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
    Pages519-522
    Number of pages4
    DOIs
    Publication statusPublished - 2009
    Event2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP - Virginia Beach, VA
    Duration: 2009 Oct 182009 Oct 21

    Other

    Other2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
    CityVirginia Beach, VA
    Period09/10/1809/10/21

    Fingerprint

    Epoxy Resins
    Epoxy resins
    Silicon Dioxide
    Dielectric properties
    Fillers
    Silica
    Dielectric losses
    Glass transition
    Clay
    Permittivity
    Temperature
    clay

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

    Cite this

    Hyuga, M., Tagami, N., Tanaka, T., Ohki, Y., Imai, T., Harada, M., & Ochi, M. (2009). Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP (pp. 519-522). [5377845] https://doi.org/10.1109/CEIDP.2009.5377845

    Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica. / Hyuga, Mayumi; Tagami, Naoki; Tanaka, Toshikatsu; Ohki, Yoshimichi; Imai, Takahiro; Harada, Miyuki; Ochi, Mitsukazu.

    Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2009. p. 519-522 5377845.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Hyuga, M, Tagami, N, Tanaka, T, Ohki, Y, Imai, T, Harada, M & Ochi, M 2009, Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica. in Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP., 5377845, pp. 519-522, 2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, Virginia Beach, VA, 09/10/18. https://doi.org/10.1109/CEIDP.2009.5377845
    Hyuga M, Tagami N, Tanaka T, Ohki Y, Imai T, Harada M et al. Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2009. p. 519-522. 5377845 https://doi.org/10.1109/CEIDP.2009.5377845
    Hyuga, Mayumi ; Tagami, Naoki ; Tanaka, Toshikatsu ; Ohki, Yoshimichi ; Imai, Takahiro ; Harada, Miyuki ; Ochi, Mitsukazu. / Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica. Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2009. pp. 519-522
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