Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica

Mayumi Hyuga, Naoki Tagami, Toshikatsu Tanaka, Yoshimichi Ohki, Takahiro Imai, Miyuki Harada, Mitsukazu Ochi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Effects of addition of micro-sized silica fillers and/or nano-sized clay fillers into epoxy resin on its dielectric properties were examined. The glass transition intermediate temperature (Tg) was found to show a decrease by the addition of a small amount of nanofillers, while it is increased by the addition of abundant microfillers with and without co-addition of a small amount of nanofillers. At temperatures above Tg, the samples with abundant microfillers were added have low conductivity, low dielectric constant, and low dielectric loss factor regardless of the co-addition of nanofillers.

Original languageEnglish
Title of host publicationCEIDP - 2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena
Pages519-522
Number of pages4
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP - Virginia Beach, VA, United States
Duration: 2009 Oct 182009 Oct 21

Publication series

NameAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
ISSN (Print)0084-9162

Conference

Conference2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
CountryUnited States
CityVirginia Beach, VA
Period09/10/1809/10/21

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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