Improvement in the reliability of crystalline silicon solar cell interconnection by using Nickel Micro-Plating Bonding (NMPB) technology

Xinguang Yu, Zhi Fu, Isamu Morisako, Keiko Koshiba, Tomonori Iizuka, Kohei Tatsumi*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

It is popular to research promoting the light conversion efficiency of crystalline silicon solar cell photovoltaic (PV) modules. However, excellent light conversion efficiency does not mean it could maintain initial performance after long-term running. Long-term reliability of interconnection to assemble crystalline silicon solar cells in PV modules is critical to ensure that the device performs continually for up to 20 years. It is reported that most crystalline PV modules fail from corrosion and breakage of the interconnector with the solder joint. As a result, improvement of interconnection technology is highly necessary. Nickel (Ni) Micro-Plating Bonding (NMPB) is an innovative interconnection technology for crystalline silicon solar cells: copper ribbons bonded with lead or lead-free solder are replaced by copper wires bonded with Ni electroplating film. The NMPB interconnection provides key advantages: low temperature (55 °C) process, enhancement of reliability from strain and stress caused by high temperature, and coefficient of thermal expansion (CTE) mismatch between metal and silicon. Furthermore, the material of NMPB, Ni, possesses excellent corrosion resistance. High reliability was confirmed with about 1.9% degradation of output power for up to 1000 thermal cycling tests and 3.8% for 1000 h of damp heat tests in bare NMPB solar cells, while 64.7% degradation in thermal cycling tests and 23.0% in damp heat tests were confirmed in solder bonding solder cells.

Original languageEnglish
Article number012001
JournalJapanese journal of applied physics
Volume62
Issue number1
DOIs
Publication statusPublished - 2023 Jan 1

Keywords

  • crystalline silicon
  • interconnection
  • micro-plating
  • nickel
  • reliability
  • solar cell

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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