Improvement in thermal reliability in gold-aluminum bonds encapsulated in bi-phenyl epoxy resin

Tomohiro Uno*, Shinichi Terashima, Kozo Onoue, Kohei Tatsumi

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

3 Citations (Scopus)


Bond degradation of Au wire/Al pad has become a major problem, because of the use of molding resin with low thermal stability (ex. bi-phenyl epoxy resin) and the use of the IC devices under high thermal environments. It is therefore important to secure the Au/Al bond reliability under high temperatures. The lifetime to bond failure for bi-phenyl epoxy molding became shorter than that for cresol novolac epoxy. The failures were caused by the corrosion reaction of Au-Al intermetallics with bromine(Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au4Al phase formed in the bond interface. The governing factors of the bond corrosion were investigated such as resin compound, gold wire material. Especially impurities in gold wire could affect the Au-Al intermetallic growing and therefore retard the corrosion. The use of the alloyed wire was effective in improving the bond reliability.

Original languageEnglish
Pages (from-to)591-596
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - 1998 Dec 1
Externally publishedYes
EventProceedings of the 1998 International Symposium on Microelectronics - San Diego, CA, USA
Duration: 1998 Nov 11998 Nov 4

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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