Improvement in thermal reliability in gold-aluminum bonds encapsulated in bi-phenyl epoxy resin

Tomohiro Uno, Shinichi Terashima, Kozo Onoue, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Bond degradation of Au wire/Al pad has become a major problem, because of the use of molding resin with low thermal stability (ex. bi-phenyl epoxy resin) and the use of the IC devices under high thermal environments. It is therefore important to secure the Au/Al bond reliability under high temperatures. The lifetime to bond failure for bi-phenyl epoxy molding became shorter than that for cresol novolac epoxy. The failures were caused by the corrosion reaction of Au-Al intermetallics with bromine(Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au4Al phase formed in the bond interface. The governing factors of the bond corrosion were investigated such as resin compound, gold wire material. Especially impurities in gold wire could affect the Au-Al intermetallic growing and therefore retard the corrosion. The use of the alloyed wire was effective in improving the bond reliability.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Editors Anon
PublisherSPIE
Pages591-596
Number of pages6
Volume3582
Publication statusPublished - 1998
Externally publishedYes
EventProceedings of the 1998 International Symposium on Microelectronics - San Diego, CA, USA
Duration: 1998 Nov 11998 Nov 4

Other

OtherProceedings of the 1998 International Symposium on Microelectronics
CitySan Diego, CA, USA
Period98/11/198/11/4

Fingerprint

epoxy resins
Epoxy resins
Gold
wire
Wire
resins
gold
Intermetallics
aluminum
intermetallics
Aluminum
corrosion
Resins
Corrosion
Molding
Gold compounds
cresols
thermal environments
Bromine
bromine

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Uno, T., Terashima, S., Onoue, K., & Tatsumi, K. (1998). Improvement in thermal reliability in gold-aluminum bonds encapsulated in bi-phenyl epoxy resin. In Anon (Ed.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 3582, pp. 591-596). SPIE.

Improvement in thermal reliability in gold-aluminum bonds encapsulated in bi-phenyl epoxy resin. / Uno, Tomohiro; Terashima, Shinichi; Onoue, Kozo; Tatsumi, Kohei.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / Anon. Vol. 3582 SPIE, 1998. p. 591-596.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Uno, T, Terashima, S, Onoue, K & Tatsumi, K 1998, Improvement in thermal reliability in gold-aluminum bonds encapsulated in bi-phenyl epoxy resin. in Anon (ed.), Proceedings of SPIE - The International Society for Optical Engineering. vol. 3582, SPIE, pp. 591-596, Proceedings of the 1998 International Symposium on Microelectronics, San Diego, CA, USA, 98/11/1.
Uno T, Terashima S, Onoue K, Tatsumi K. Improvement in thermal reliability in gold-aluminum bonds encapsulated in bi-phenyl epoxy resin. In Anon, editor, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3582. SPIE. 1998. p. 591-596
Uno, Tomohiro ; Terashima, Shinichi ; Onoue, Kozo ; Tatsumi, Kohei. / Improvement in thermal reliability in gold-aluminum bonds encapsulated in bi-phenyl epoxy resin. Proceedings of SPIE - The International Society for Optical Engineering. editor / Anon. Vol. 3582 SPIE, 1998. pp. 591-596
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