Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character

S. Terashima, T. Kohno, A. Mizusawa, K. Arai, O. Okada, T. Wakabayashi, M. Tanaka, K. Tatsumi

Research output: Contribution to journalArticle

30 Citations (Scopus)

Abstract

Thermal fatigue properties of commercial LF35 (Sn-1.2Ag-0.5Cu-0.05Ni), SAC105 (Sn-1Ag-0.5Cu), and SAC305 (Sn-3Ag-0.5Cu) solders on Casio's wafer-level packages are discussed from the viewpoints of both morphology and grain boundary character. Orientation imaging microscopy revealed that both LF35 and SAC305 resisted the coarsening of tin grains during thermal fatigue as compared with SAC105, correlating with their greater fraction of coincidence site lattice boundaries. This seems to explain why LF35 has superior thermal fatigue life in spite of its lower silver content.

Original languageEnglish
Pages (from-to)33-38
Number of pages6
JournalJournal of Electronic Materials
Volume38
Issue number1
DOIs
Publication statusPublished - 2009 Jan 1

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Keywords

  • Grain boundary character distribution
  • Lead-free solder
  • Orientation imaging microscopy
  • Sn-Ag-Cu
  • Thermal fatigue

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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