Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character

S. Terashima, T. Kohno, A. Mizusawa, K. Arai, O. Okada, T. Wakabayashi, M. Tanaka, Kohei Tatsumi

Research output: Contribution to journalArticle

30 Citations (Scopus)

Abstract

Thermal fatigue properties of commercial LF35 (Sn-1.2Ag-0.5Cu-0.05Ni), SAC105 (Sn-1Ag-0.5Cu), and SAC305 (Sn-3Ag-0.5Cu) solders on Casio's wafer-level packages are discussed from the viewpoints of both morphology and grain boundary character. Orientation imaging microscopy revealed that both LF35 and SAC305 resisted the coarsening of tin grains during thermal fatigue as compared with SAC105, correlating with their greater fraction of coincidence site lattice boundaries. This seems to explain why LF35 has superior thermal fatigue life in spite of its lower silver content.

Original languageEnglish
Pages (from-to)33-38
Number of pages6
JournalJournal of Electronic Materials
Volume38
Issue number1
DOIs
Publication statusPublished - 2009 Jan
Externally publishedYes

Fingerprint

thermal fatigue
Thermal fatigue
solders
Grain boundaries
grain boundaries
wafers
Tin
fatigue life
Coarsening
Silver
Crystal orientation
Soldering alloys
tin
Microscopic examination
silver
Fatigue of materials
microscopy
Imaging techniques
Lead-free solders

Keywords

  • Grain boundary character distribution
  • Lead-free solder
  • Orientation imaging microscopy
  • Sn-Ag-Cu
  • Thermal fatigue

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry

Cite this

Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character. / Terashima, S.; Kohno, T.; Mizusawa, A.; Arai, K.; Okada, O.; Wakabayashi, T.; Tanaka, M.; Tatsumi, Kohei.

In: Journal of Electronic Materials, Vol. 38, No. 1, 01.2009, p. 33-38.

Research output: Contribution to journalArticle

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AU - Mizusawa, A.

AU - Arai, K.

AU - Okada, O.

AU - Wakabayashi, T.

AU - Tanaka, M.

AU - Tatsumi, Kohei

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