Improving epoxy-based insulating materials with nano-fillers toward practical application

Takahiro Imai, Gen Komiya, Kiyoko Murayama, Tamon Ozaki, Fumio Sawa, Toshio Shimizu, Miyuki Harada, Mitsukazu Ochi, Yoshimichi Ohki, Toshikatsu Tanaka

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    31 Citations (Scopus)

    Abstract

    A primary concern in recent nanocomposite research is practical application. In this study, various kinds of epoxy-based nanocomposites were made and their properties evaluated to determine their applicability as insulating materials for heavy electric apparatuses. Experimental results demonstrated that nano-fillers enhance insulation breakdown properties in nanocomposites. Moreover, nano- and micro-filler combinations were adopted as an approach toward practical application of nanocomposite insulating materials. These nano- and micro-filler mixed composites had the same low thermal expansion as aluminum, and insulation breakdown properties superior to those of conventional insulating materials. Consequently, an aluminum conductor and a vacuum interrupter were molded by the nano- and micro-filler mixed composites for the first time in nanocomposite research.

    Original languageEnglish
    Title of host publicationConference Record of IEEE International Symposium on Electrical Insulation
    Pages201-204
    Number of pages4
    DOIs
    Publication statusPublished - 2008
    Event2008 IEEE International Symposium on Electrical Insulation, ISEI 2008 - Vancouver, BC, Canada
    Duration: 2008 Jun 92008 Jun 12

    Other

    Other2008 IEEE International Symposium on Electrical Insulation, ISEI 2008
    CountryCanada
    CityVancouver, BC
    Period08/6/908/6/12

    Fingerprint

    Insulating materials
    Fillers
    Nanocomposites
    Insulation
    Aluminum
    Composite materials
    Thermal expansion
    Vacuum

    ASJC Scopus subject areas

    • Building and Construction
    • Electrical and Electronic Engineering

    Cite this

    Imai, T., Komiya, G., Murayama, K., Ozaki, T., Sawa, F., Shimizu, T., ... Tanaka, T. (2008). Improving epoxy-based insulating materials with nano-fillers toward practical application. In Conference Record of IEEE International Symposium on Electrical Insulation (pp. 201-204). [4570310] https://doi.org/10.1109/ELINSL.2008.4570310

    Improving epoxy-based insulating materials with nano-fillers toward practical application. / Imai, Takahiro; Komiya, Gen; Murayama, Kiyoko; Ozaki, Tamon; Sawa, Fumio; Shimizu, Toshio; Harada, Miyuki; Ochi, Mitsukazu; Ohki, Yoshimichi; Tanaka, Toshikatsu.

    Conference Record of IEEE International Symposium on Electrical Insulation. 2008. p. 201-204 4570310.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Imai, T, Komiya, G, Murayama, K, Ozaki, T, Sawa, F, Shimizu, T, Harada, M, Ochi, M, Ohki, Y & Tanaka, T 2008, Improving epoxy-based insulating materials with nano-fillers toward practical application. in Conference Record of IEEE International Symposium on Electrical Insulation., 4570310, pp. 201-204, 2008 IEEE International Symposium on Electrical Insulation, ISEI 2008, Vancouver, BC, Canada, 08/6/9. https://doi.org/10.1109/ELINSL.2008.4570310
    Imai T, Komiya G, Murayama K, Ozaki T, Sawa F, Shimizu T et al. Improving epoxy-based insulating materials with nano-fillers toward practical application. In Conference Record of IEEE International Symposium on Electrical Insulation. 2008. p. 201-204. 4570310 https://doi.org/10.1109/ELINSL.2008.4570310
    Imai, Takahiro ; Komiya, Gen ; Murayama, Kiyoko ; Ozaki, Tamon ; Sawa, Fumio ; Shimizu, Toshio ; Harada, Miyuki ; Ochi, Mitsukazu ; Ohki, Yoshimichi ; Tanaka, Toshikatsu. / Improving epoxy-based insulating materials with nano-fillers toward practical application. Conference Record of IEEE International Symposium on Electrical Insulation. 2008. pp. 201-204
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