In situ measurement for diffusion-adsorption process of Cl and SPS in through-silicon via using SERS effect produced by Cu nanodot arrays

Masahiro Kunimoto, Futa Yamaguchi, Masahiro Yanagisawa, Takayuki Homma

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1 Citation (Scopus)

Abstract

In this study, we analyzed the diffusion behavior of additives, such as Cl− and bis-(3-sulfopropyl) disulfide (SPS), during the through-silicon via process with our surface-enhanced Raman spectroscopy (SERS) measurement system equipped with a model structure of a micro via. The via structure, made of poly(dimethyl siloxane) (PDMS), which has a transparent wall, was attached horizontally on the Cu nano-patterned substrate, an array of nanodots with 150-nm diameter and 300-nm pitch. This substrate provides the SERS effect with high uniformity and also works as one of the sidewalls of the via. The simultaneous diffusion of Cl− and SPS into the micro via on the Cu nanodot wall was observed by Raman microspectroscopy. The obtained SERS spectrum clearly indicated the diffusion of these two species. First, Cl− adsorbs on Cu, because it has a larger diffusion coefficient; SPS removes the pre-adsorbed Cl to dominate the adsorption site of the surface a few minutes later. Pre-adsorbed SPS is sufficiently stable, and is not removed by a highly negative potential (for example, −200 mV vs. Ag/AgCl).

Original languageEnglish
Pages (from-to)D212-D217
JournalJournal of the Electrochemical Society
Volume166
Issue number6
DOIs
Publication statusPublished - 2019 Jan 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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