Influence of cable structure on the fault location by frequency domain reflectometry

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

The authors have demonstrated that the estimation of the precise locations of points in cables aged thermally or mechanically or by the irradiation of gamma rays is possible by a combination of frequency domain reflectometry (FDR) and inverse fast Fourier transform (IFFT). This paper examines how this ability of fault location depends on the type and structure of the cable, using several kinds of polymer insulated cables such as triple core cables insulated with flame-retardant ethylene propylene diene copolymer (FR-EPDM), dual core cables insulated with silicone rubber (SiR) or crosslinked polyolefin (XLPO), and coaxial cylindrical cables insulated with low density polyethylene (LDPE). As a result, for cables with lengths of 16 to 72 m, the maximum sensitivity is attained when the highest frequency of the inputted electromagnetic waves is 1.0 GHz or higher for coaxial cables, but around 600 to 800 MHz for dual or triple core cables.

Original languageEnglish
Title of host publicationAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages274-277
Number of pages4
Volume2015-December
ISBN (Print)9781467374972
DOIs
Publication statusPublished - 2015 Dec 9
EventIEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2015 - Ann Arbor, United States
Duration: 2015 Oct 182015 Oct 21

Other

OtherIEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2015
CountryUnited States
CityAnn Arbor
Period15/10/1815/10/21

Fingerprint

Electric fault location
Cables
Cable cores
Flame Retardants
Silicone Elastomers
Coaxial cables
Polyolefins
Low density polyethylenes
Polyethylene
Flame retardants
Gamma rays
Silicones
Fast Fourier transforms
Electromagnetic waves
Propylene
Rubber
Polymers
Ethylene
Copolymers
Irradiation

Keywords

  • aging
  • cable
  • condition monitoring
  • fault location
  • frequency domain reflectometry
  • predictive maintenance

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Ohki, Y., & Hirai, N. (2015). Influence of cable structure on the fault location by frequency domain reflectometry. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP (Vol. 2015-December, pp. 274-277). [7352023] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP.2015.7352023

Influence of cable structure on the fault location by frequency domain reflectometry. / Ohki, Yoshimichi; Hirai, Naoshi.

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. Vol. 2015-December Institute of Electrical and Electronics Engineers Inc., 2015. p. 274-277 7352023.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ohki, Y & Hirai, N 2015, Influence of cable structure on the fault location by frequency domain reflectometry. in Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. vol. 2015-December, 7352023, Institute of Electrical and Electronics Engineers Inc., pp. 274-277, IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2015, Ann Arbor, United States, 15/10/18. https://doi.org/10.1109/CEIDP.2015.7352023
Ohki Y, Hirai N. Influence of cable structure on the fault location by frequency domain reflectometry. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. Vol. 2015-December. Institute of Electrical and Electronics Engineers Inc. 2015. p. 274-277. 7352023 https://doi.org/10.1109/CEIDP.2015.7352023
Ohki, Yoshimichi ; Hirai, Naoshi. / Influence of cable structure on the fault location by frequency domain reflectometry. Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. Vol. 2015-December Institute of Electrical and Electronics Engineers Inc., 2015. pp. 274-277
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