Influence of water absorption on charge formation in printed circuit board insulations

Hidesato Tanaka, Yoshimichi Ohki, Kaori Fukunaga, Takashi Maeno, Kenji Okamoto

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

While the reliability of bulk insulation has become important particularly in multilayer boards and embedded boards, electronics are to be used under various environments such as at high temperature and in high humidity. We observed internal space charge behavior for two types of epoxy composites under dc electric fields to investigate the influence of water at high temperature. In the case of glass/epoxy specimen, homocharge is observed at water-treated specimen, and spatial oscillations become clearer in the water-treated specimens. Electric field in the vicinity of the electrodes shows the injection of homocharge. In aramid/epoxy specimens, heterocharge is observed at water-treated specimens, i.e. negative charge accumulates near the anode, while positive charge accumulates near the cathode. Electric field is enhanced just before each electrode. In order to further examine the mechanism of space charge formation, we have developed a new system that allows in situ space charge observation during ion migration tests at high temperature and high humidity. Using this in situ system, it was also confirmed that heterocharge was observed in water-treated aramid/epoxy composite.

Original languageEnglish
Pages53-56
Number of pages4
DOIs
Publication statusPublished - 2005 Jan 1
Event2005 International Symposium on Electrical Insulating Materials, ISEIM 2005 - Kitakyushu, Japan
Duration: 2005 Jun 52005 Jun 9

Conference

Conference2005 International Symposium on Electrical Insulating Materials, ISEIM 2005
CountryJapan
CityKitakyushu
Period05/6/505/6/9

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

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  • Cite this

    Tanaka, H., Ohki, Y., Fukunaga, K., Maeno, T., & Okamoto, K. (2005). Influence of water absorption on charge formation in printed circuit board insulations. 53-56. Paper presented at 2005 International Symposium on Electrical Insulating Materials, ISEIM 2005, Kitakyushu, Japan. https://doi.org/10.1109/iseim.2005.193322