Initial catalyzation analysis of electroless NiP nanoimprinting mold replicated from self-assembled monolayer modified nanopatterns

Cheng Ping Lin, Mikiko Saito, Takayuki Homma

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

A nanoimprint lithography mold was fabricated through electroless deposition combined with self-assembled monolayer (SAM) modification. To copy nanopatterns as "replicates", NiP was electrolessly deposited on a nanopatterned master mold (made of SiO 2/Si), whose surface was modified with 3-[2-(2-aminoethylamino)ethylamino]propyltrimethoxysilane (TAS). NiP deposits were then manually detached from the mold. SAM improves Pd catalyst coverage for electroless deposition, further improving the morphology of the electroless deposition of NiP on the nanopatterned master mold and controlling the adhesion strength between electroless deposited NiP and the nanopatterned master mold to a level appropriate for smooth detachment. The initial catalyzation process and mechanical properties (such as, the hardness and adhesion strength of the SiO 2 substrate) of electroless deposited NiP were also systematically investigated.

Original languageEnglish
Pages (from-to)75-81
Number of pages7
JournalElectrochimica Acta
Volume82
DOIs
Publication statusPublished - 2012 Nov 1

Fingerprint

Electroless plating
Self assembled monolayers
Bond strength (materials)
Nanoimprint lithography
Deposits
Hardness
Mechanical properties
Catalysts
Substrates

Keywords

  • Adhesion
  • Electroless deposition
  • Hardness
  • Nanoimprint mold
  • Self-assembled monolayer

ASJC Scopus subject areas

  • Electrochemistry
  • Chemical Engineering(all)

Cite this

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abstract = "A nanoimprint lithography mold was fabricated through electroless deposition combined with self-assembled monolayer (SAM) modification. To copy nanopatterns as {"}replicates{"}, NiP was electrolessly deposited on a nanopatterned master mold (made of SiO 2/Si), whose surface was modified with 3-[2-(2-aminoethylamino)ethylamino]propyltrimethoxysilane (TAS). NiP deposits were then manually detached from the mold. SAM improves Pd catalyst coverage for electroless deposition, further improving the morphology of the electroless deposition of NiP on the nanopatterned master mold and controlling the adhesion strength between electroless deposited NiP and the nanopatterned master mold to a level appropriate for smooth detachment. The initial catalyzation process and mechanical properties (such as, the hardness and adhesion strength of the SiO 2 substrate) of electroless deposited NiP were also systematically investigated.",
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author = "Lin, {Cheng Ping} and Mikiko Saito and Takayuki Homma",
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AU - Saito, Mikiko

AU - Homma, Takayuki

PY - 2012/11/1

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N2 - A nanoimprint lithography mold was fabricated through electroless deposition combined with self-assembled monolayer (SAM) modification. To copy nanopatterns as "replicates", NiP was electrolessly deposited on a nanopatterned master mold (made of SiO 2/Si), whose surface was modified with 3-[2-(2-aminoethylamino)ethylamino]propyltrimethoxysilane (TAS). NiP deposits were then manually detached from the mold. SAM improves Pd catalyst coverage for electroless deposition, further improving the morphology of the electroless deposition of NiP on the nanopatterned master mold and controlling the adhesion strength between electroless deposited NiP and the nanopatterned master mold to a level appropriate for smooth detachment. The initial catalyzation process and mechanical properties (such as, the hardness and adhesion strength of the SiO 2 substrate) of electroless deposited NiP were also systematically investigated.

AB - A nanoimprint lithography mold was fabricated through electroless deposition combined with self-assembled monolayer (SAM) modification. To copy nanopatterns as "replicates", NiP was electrolessly deposited on a nanopatterned master mold (made of SiO 2/Si), whose surface was modified with 3-[2-(2-aminoethylamino)ethylamino]propyltrimethoxysilane (TAS). NiP deposits were then manually detached from the mold. SAM improves Pd catalyst coverage for electroless deposition, further improving the morphology of the electroless deposition of NiP on the nanopatterned master mold and controlling the adhesion strength between electroless deposited NiP and the nanopatterned master mold to a level appropriate for smooth detachment. The initial catalyzation process and mechanical properties (such as, the hardness and adhesion strength of the SiO 2 substrate) of electroless deposited NiP were also systematically investigated.

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KW - Self-assembled monolayer

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