Initial propagation stage of direct copper plating on non-conducting substrates

Sachiko Ono, Kazuhisa Naitoh, Tetsuya Osaka

Research output: Contribution to journalArticle

24 Citations (Scopus)

Abstract

The initial propagation stage of direct copper plating on non-conducting resin substrates was studied by a high resolution transmission electron microscope, an electron diffraction and a scanning electron microscope analysis to confirm the mechanism. In this process, ABS resin substrate was catalyzed by Pd/Sn mixed catalyst and accelerated in a solution containing copper ions before the direct plating. Cubic Cu2O crystals approximately 20-50 nm in size were formed along the migration front of direct copper plating to provide stepping stones for copper propagation, while few such crystals were found on a residual uncovered catalyst area. At the thicker copper plated area, Cu2O crystals were embedded in a flat copper deposit which was composed of small crystals 10-20 nm in size. The Cu2O crystals should be activation sites for copper deposition by the formation of additive free metallic copper according to disproportionation reaction and so that promote the propagation speed. This effect can be explained by 'a modified stepwise propagation mechanism' in which Cu2O crystals act a critical roll for the copper propagation as stepping stones in addition to dispersed Cu particle seeds and Pd catalyst cluster seeds.

Original languageEnglish
Pages (from-to)3697-3705
Number of pages9
JournalElectrochimica Acta
Volume44
Issue number21
Publication statusPublished - 1999 Jun 1

Fingerprint

Copper plating
Copper
Crystals
Substrates
Catalysts
Seed
Electron microscopes
ABS resins
Copper deposits
Plating
Electron diffraction
Resins
Chemical activation
Ions
Scanning

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Analytical Chemistry
  • Electrochemistry

Cite this

Initial propagation stage of direct copper plating on non-conducting substrates. / Ono, Sachiko; Naitoh, Kazuhisa; Osaka, Tetsuya.

In: Electrochimica Acta, Vol. 44, No. 21, 01.06.1999, p. 3697-3705.

Research output: Contribution to journalArticle

Ono, Sachiko ; Naitoh, Kazuhisa ; Osaka, Tetsuya. / Initial propagation stage of direct copper plating on non-conducting substrates. In: Electrochimica Acta. 1999 ; Vol. 44, No. 21. pp. 3697-3705.
@article{1a202220cfa749718ed8cbaaa8915c67,
title = "Initial propagation stage of direct copper plating on non-conducting substrates",
abstract = "The initial propagation stage of direct copper plating on non-conducting resin substrates was studied by a high resolution transmission electron microscope, an electron diffraction and a scanning electron microscope analysis to confirm the mechanism. In this process, ABS resin substrate was catalyzed by Pd/Sn mixed catalyst and accelerated in a solution containing copper ions before the direct plating. Cubic Cu2O crystals approximately 20-50 nm in size were formed along the migration front of direct copper plating to provide stepping stones for copper propagation, while few such crystals were found on a residual uncovered catalyst area. At the thicker copper plated area, Cu2O crystals were embedded in a flat copper deposit which was composed of small crystals 10-20 nm in size. The Cu2O crystals should be activation sites for copper deposition by the formation of additive free metallic copper according to disproportionation reaction and so that promote the propagation speed. This effect can be explained by 'a modified stepwise propagation mechanism' in which Cu2O crystals act a critical roll for the copper propagation as stepping stones in addition to dispersed Cu particle seeds and Pd catalyst cluster seeds.",
author = "Sachiko Ono and Kazuhisa Naitoh and Tetsuya Osaka",
year = "1999",
month = "6",
day = "1",
language = "English",
volume = "44",
pages = "3697--3705",
journal = "Electrochimica Acta",
issn = "0013-4686",
publisher = "Elsevier Limited",
number = "21",

}

TY - JOUR

T1 - Initial propagation stage of direct copper plating on non-conducting substrates

AU - Ono, Sachiko

AU - Naitoh, Kazuhisa

AU - Osaka, Tetsuya

PY - 1999/6/1

Y1 - 1999/6/1

N2 - The initial propagation stage of direct copper plating on non-conducting resin substrates was studied by a high resolution transmission electron microscope, an electron diffraction and a scanning electron microscope analysis to confirm the mechanism. In this process, ABS resin substrate was catalyzed by Pd/Sn mixed catalyst and accelerated in a solution containing copper ions before the direct plating. Cubic Cu2O crystals approximately 20-50 nm in size were formed along the migration front of direct copper plating to provide stepping stones for copper propagation, while few such crystals were found on a residual uncovered catalyst area. At the thicker copper plated area, Cu2O crystals were embedded in a flat copper deposit which was composed of small crystals 10-20 nm in size. The Cu2O crystals should be activation sites for copper deposition by the formation of additive free metallic copper according to disproportionation reaction and so that promote the propagation speed. This effect can be explained by 'a modified stepwise propagation mechanism' in which Cu2O crystals act a critical roll for the copper propagation as stepping stones in addition to dispersed Cu particle seeds and Pd catalyst cluster seeds.

AB - The initial propagation stage of direct copper plating on non-conducting resin substrates was studied by a high resolution transmission electron microscope, an electron diffraction and a scanning electron microscope analysis to confirm the mechanism. In this process, ABS resin substrate was catalyzed by Pd/Sn mixed catalyst and accelerated in a solution containing copper ions before the direct plating. Cubic Cu2O crystals approximately 20-50 nm in size were formed along the migration front of direct copper plating to provide stepping stones for copper propagation, while few such crystals were found on a residual uncovered catalyst area. At the thicker copper plated area, Cu2O crystals were embedded in a flat copper deposit which was composed of small crystals 10-20 nm in size. The Cu2O crystals should be activation sites for copper deposition by the formation of additive free metallic copper according to disproportionation reaction and so that promote the propagation speed. This effect can be explained by 'a modified stepwise propagation mechanism' in which Cu2O crystals act a critical roll for the copper propagation as stepping stones in addition to dispersed Cu particle seeds and Pd catalyst cluster seeds.

UR - http://www.scopus.com/inward/record.url?scp=0032685096&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032685096&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0032685096

VL - 44

SP - 3697

EP - 3705

JO - Electrochimica Acta

JF - Electrochimica Acta

SN - 0013-4686

IS - 21

ER -