Abstract
A method of interconnecting micropad electrodes was developed by using the electroless deposition of NiB for application to the flip-chip bonding technology. The phenomenon of "bridge" formation by the so-called "extraneous deposition" was utilized as a technique to perform selective deposition of NiB on noncatalytic surfaces. The process of extraneous electroless deposition was controlled by optimizing deposition conditions so that the deposit grew anisotropically along the surface between the facing pads. Practical feasibility of this technique was demonstrated by forming an interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.
| Original language | English |
|---|---|
| Pages (from-to) | 92-94 |
| Number of pages | 3 |
| Journal | Electrochemical and Solid-State Letters |
| Volume | 10 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - 2007 |
| Externally published | Yes |
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ASJC Scopus subject areas
- Electrochemistry
- Materials Science(all)
Cite this
Interconnection of micropad electrodes by controlled "extraneous" deposition of electroless NiB film. / Yokoshima, Tokihiko; Yamaji, Yasuhiro; Oosato, Hirotaka; Tamura, Yuichiro; Kikuchi, Katsuya; Nakagawa, Hiroshi; Aoyagi, Masahiro.
In: Electrochemical and Solid-State Letters, Vol. 10, No. 9, 2007, p. 92-94.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Interconnection of micropad electrodes by controlled "extraneous" deposition of electroless NiB film
AU - Yokoshima, Tokihiko
AU - Yamaji, Yasuhiro
AU - Oosato, Hirotaka
AU - Tamura, Yuichiro
AU - Kikuchi, Katsuya
AU - Nakagawa, Hiroshi
AU - Aoyagi, Masahiro
PY - 2007
Y1 - 2007
N2 - A method of interconnecting micropad electrodes was developed by using the electroless deposition of NiB for application to the flip-chip bonding technology. The phenomenon of "bridge" formation by the so-called "extraneous deposition" was utilized as a technique to perform selective deposition of NiB on noncatalytic surfaces. The process of extraneous electroless deposition was controlled by optimizing deposition conditions so that the deposit grew anisotropically along the surface between the facing pads. Practical feasibility of this technique was demonstrated by forming an interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.
AB - A method of interconnecting micropad electrodes was developed by using the electroless deposition of NiB for application to the flip-chip bonding technology. The phenomenon of "bridge" formation by the so-called "extraneous deposition" was utilized as a technique to perform selective deposition of NiB on noncatalytic surfaces. The process of extraneous electroless deposition was controlled by optimizing deposition conditions so that the deposit grew anisotropically along the surface between the facing pads. Practical feasibility of this technique was demonstrated by forming an interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.
UR - http://www.scopus.com/inward/record.url?scp=34547194685&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34547194685&partnerID=8YFLogxK
U2 - 10.1149/1.2752455
DO - 10.1149/1.2752455
M3 - Article
AN - SCOPUS:34547194685
VL - 10
SP - 92
EP - 94
JO - Electrochemical and Solid-State Letters
JF - Electrochemical and Solid-State Letters
SN - 1099-0062
IS - 9
ER -