Interconnection of micropad electrodes by controlled "extraneous" deposition of electroless NiB film

Tokihiko Yokoshima; Yasuhiro Yamaji; Hirotaka Oosato; Yuichiro Tamura; Katsuya Kikuchi; Hiroshi Nakagawa; Masahiro Aoyagi

doi:10.1149/1.2752455

Interconnection of micropad electrodes by controlled "extraneous" deposition of electroless NiB film

Tokihiko Yokoshima^*, Yasuhiro Yamaji, Hirotaka Oosato, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

A method of interconnecting micropad electrodes was developed by using the electroless deposition of NiB for application to the flip-chip bonding technology. The phenomenon of "bridge" formation by the so-called "extraneous deposition" was utilized as a technique to perform selective deposition of NiB on noncatalytic surfaces. The process of extraneous electroless deposition was controlled by optimizing deposition conditions so that the deposit grew anisotropically along the surface between the facing pads. Practical feasibility of this technique was demonstrated by forming an interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.

Original language	English
Pages (from-to)	92-94
Number of pages	3
Journal	Electrochemical and Solid-State Letters
Volume	10
Issue number	9
DOIs	https://doi.org/10.1149/1.2752455
Publication status	Published - 2007 Aug 1
Externally published	Yes

ASJC Scopus subject areas

Chemical Engineering(all)
Materials Science(all)
Physical and Theoretical Chemistry
Electrochemistry
Electrical and Electronic Engineering

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10.1149/1.2752455

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abstract = "A method of interconnecting micropad electrodes was developed by using the electroless deposition of NiB for application to the flip-chip bonding technology. The phenomenon of {"}bridge{"} formation by the so-called {"}extraneous deposition{"} was utilized as a technique to perform selective deposition of NiB on noncatalytic surfaces. The process of extraneous electroless deposition was controlled by optimizing deposition conditions so that the deposit grew anisotropically along the surface between the facing pads. Practical feasibility of this technique was demonstrated by forming an interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.",

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T1 - Interconnection of micropad electrodes by controlled "extraneous" deposition of electroless NiB film

AU - Yokoshima, Tokihiko

AU - Yamaji, Yasuhiro

AU - Oosato, Hirotaka

AU - Tamura, Yuichiro

AU - Kikuchi, Katsuya

AU - Nakagawa, Hiroshi

AU - Aoyagi, Masahiro

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AB - A method of interconnecting micropad electrodes was developed by using the electroless deposition of NiB for application to the flip-chip bonding technology. The phenomenon of "bridge" formation by the so-called "extraneous deposition" was utilized as a technique to perform selective deposition of NiB on noncatalytic surfaces. The process of extraneous electroless deposition was controlled by optimizing deposition conditions so that the deposit grew anisotropically along the surface between the facing pads. Practical feasibility of this technique was demonstrated by forming an interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.

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Interconnection of micropad electrodes by controlled "extraneous" deposition of electroless NiB film

Abstract

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