Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film

T. Yokoshima; Y. Yamaji; N. Igawa; Y. Tamura; K. Kikuchi; H. Nakagawa; M. Aoyagi

doi:10.1149/1.2931343

Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film

T. Yokoshima^*, Y. Yamaji, N. Igawa, Y. Tamura, K. Kikuchi, H. Nakagawa, M. Aoyagi

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

Interconnection of multi-pad array was developed by using the electroless CAEx deposition of NiB for application to the new flipchip bonding technology. Behavior of CAEx deposition of Electroless NiB films was depended on pad width and distance between facing pads, and pad with nearer distance and wider pad size was achieved. Practical feasibility of this technique was demonstrated by forming interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.

Original language	English
Title of host publication	ECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2
Publisher	Electrochemical Society Inc.
Pages	65-74
Number of pages	10
Edition	28
ISBN (Electronic)	9781566776417
ISBN (Print)	9781605601991
DOIs	https://doi.org/10.1149/1.2931343
Publication status	Published - 2007
Externally published	Yes
Event	Electrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting - Washington, DC, United States Duration: 2007 Oct 7 → 2007 Oct 12

Publication series

Name	ECS Transactions
Number	28
Volume	11
ISSN (Print)	1938-5862
ISSN (Electronic)	1938-6737

Conference

Conference	Electrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting
Country/Territory	United States
City	Washington, DC
Period	07/10/7 → 07/10/12

ASJC Scopus subject areas

Engineering(all)

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10.1149/1.2931343

Cite this

Yokoshima, T., Yamaji, Y., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2007). Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film. In ECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2 (28 ed., pp. 65-74). (ECS Transactions; Vol. 11, No. 28). Electrochemical Society Inc.. https://doi.org/10.1149/1.2931343

Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film. / Yokoshima, T.; Yamaji, Y.; Igawa, N. et al.

ECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2. 28. ed. Electrochemical Society Inc., 2007. p. 65-74 (ECS Transactions; Vol. 11, No. 28).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yokoshima, T, Yamaji, Y, Igawa, N, Tamura, Y, Kikuchi, K, Nakagawa, H & Aoyagi, M 2007, Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film. in ECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2. 28 edn, ECS Transactions, no. 28, vol. 11, Electrochemical Society Inc., pp. 65-74, Electrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting, Washington, DC, United States, 07/10/7. https://doi.org/10.1149/1.2931343

Yokoshima T, Yamaji Y, Igawa N, Tamura Y, Kikuchi K, Nakagawa H et al. Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film. In ECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2. 28 ed. Electrochemical Society Inc. 2007. p. 65-74. (ECS Transactions; 28). doi: 10.1149/1.2931343

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abstract = "Interconnection of multi-pad array was developed by using the electroless CAEx deposition of NiB for application to the new flipchip bonding technology. Behavior of CAEx deposition of Electroless NiB films was depended on pad width and distance between facing pads, and pad with nearer distance and wider pad size was achieved. Practical feasibility of this technique was demonstrated by forming interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.",

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AB - Interconnection of multi-pad array was developed by using the electroless CAEx deposition of NiB for application to the new flipchip bonding technology. Behavior of CAEx deposition of Electroless NiB films was depended on pad width and distance between facing pads, and pad with nearer distance and wider pad size was achieved. Practical feasibility of this technique was demonstrated by forming interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.

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Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film

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