Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film

Tokihiko Yokoshima, Y. Yamaji, N. Igawa, Y. Tamura, K. Kikuchi, H. Nakagawa, M. Aoyagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Interconnection of multi-pad array was developed by using the electroless CAEx deposition of NiB for application to the new flipchip bonding technology. Behavior of CAEx deposition of Electroless NiB films was depended on pad width and distance between facing pads, and pad with nearer distance and wider pad size was achieved. Practical feasibility of this technique was demonstrated by forming interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.

Original languageEnglish
Title of host publicationECS Transactions
Pages65-74
Number of pages10
Volume11
Edition28
DOIs
Publication statusPublished - 2008
Externally publishedYes
EventElectrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting - Washington, DC
Duration: 2007 Oct 72007 Oct 12

Other

OtherElectrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting
CityWashington, DC
Period07/10/707/10/12

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Electrodes

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Yokoshima, T., Yamaji, Y., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2008). Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film. In ECS Transactions (28 ed., Vol. 11, pp. 65-74) https://doi.org/10.1149/1.2931343

Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film. / Yokoshima, Tokihiko; Yamaji, Y.; Igawa, N.; Tamura, Y.; Kikuchi, K.; Nakagawa, H.; Aoyagi, M.

ECS Transactions. Vol. 11 28. ed. 2008. p. 65-74.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yokoshima, T, Yamaji, Y, Igawa, N, Tamura, Y, Kikuchi, K, Nakagawa, H & Aoyagi, M 2008, Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film. in ECS Transactions. 28 edn, vol. 11, pp. 65-74, Electrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting, Washington, DC, 07/10/7. https://doi.org/10.1149/1.2931343
Yokoshima T, Yamaji Y, Igawa N, Tamura Y, Kikuchi K, Nakagawa H et al. Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film. In ECS Transactions. 28 ed. Vol. 11. 2008. p. 65-74 https://doi.org/10.1149/1.2931343
Yokoshima, Tokihiko ; Yamaji, Y. ; Igawa, N. ; Tamura, Y. ; Kikuchi, K. ; Nakagawa, H. ; Aoyagi, M. / Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film. ECS Transactions. Vol. 11 28. ed. 2008. pp. 65-74
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