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Intermetallic growth and void formation in Au wire ball bonds to Al pads
Tomohiro Uno,
Kohei Tatsumi
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peer-review
10
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Chemical Compounds
Intermetallics
Vacancies
Oxide films
Wire
Activation energy
Annealing
Diffusion barriers
Piles
Vacuum
Ultrasonics
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Engineering & Materials Science
Intermetallics
Vacancies
Oxide films
Wire
Activation energy
Annealing
Diffusion barriers
Piles
Vacuum
Ultrasonics
Temperature
Physics & Astronomy
balls
intermetallics
voids
wire
oxide films
activation energy
annealing
piles
ultrasonics
vacuum
causes