Abstract
This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.
Original language | English |
---|---|
Title of host publication | ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging |
Pages | 91-96 |
Number of pages | 6 |
DOIs | |
Publication status | Published - 2011 |
Event | 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai Duration: 2011 Aug 8 → 2011 Aug 11 |
Other
Other | 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 |
---|---|
City | Shanghai |
Period | 11/8/8 → 11/8/11 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering