Abstract
This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.
| Original language | English |
|---|---|
| Title of host publication | ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging |
| Pages | 91-96 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 2011 |
| Event | 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai Duration: 2011 Aug 8 → 2011 Aug 11 |
Other
| Other | 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 |
|---|---|
| City | Shanghai |
| Period | 11/8/8 → 11/8/11 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products. / Shi, Hongbin; Ueda, Toshitsugu.
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 91-96 6066797.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products
AU - Shi, Hongbin
AU - Ueda, Toshitsugu
PY - 2011
Y1 - 2011
N2 - This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.
AB - This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.
UR - http://www.scopus.com/inward/record.url?scp=81355132199&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=81355132199&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2011.6066797
DO - 10.1109/ICEPT.2011.6066797
M3 - Conference contribution
SN - 9781457717680
SP - 91
EP - 96
BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
ER -