Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products

Hongbin Shi, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    12 Citations (Scopus)

    Abstract

    This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.

    Original languageEnglish
    Title of host publicationICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
    Pages91-96
    Number of pages6
    DOIs
    Publication statusPublished - 2011
    Event2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai
    Duration: 2011 Aug 82011 Aug 11

    Other

    Other2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
    CityShanghai
    Period11/8/811/8/11

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    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Shi, H., & Ueda, T. (2011). Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 91-96). [6066797] https://doi.org/10.1109/ICEPT.2011.6066797