Investigation on the optimum sampling rate of strain measurement during printed circuit board (PCB) system assembly

Hong Bin Shi, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    This paper discusses the Min. sampling rate of strain measurement during the system assembly process. The test boards including the server, desktop computer and laptop boards with different board thickness. A 1% variation in the diagonal strain and principle strain are used as the threshold for determining the Min. sampling rate. The test results show that the absolute values of diagonal strain and principle strain reduce with the decreasing sampling rate, this trend is really apparent when the sampling rates is lower than 100Hz. In addition, the principle strain metric is more conservative than diagonal strain metric. Min. sampling rates for strain gages at different locations of boards vary widely, this is due to they have different strain rate, i.e. change in strain divided by the time interval during which this change is measured. The higher strain rate of the strain gage, the larger Min. sampling rate should be chosen. The Min. sampling rate of the server, desktop computer and laptop boards is 250 Hz, 667 Hz and 200 Hz respective. If the strain measurement equipment doesn't have the selfsame option, a higher sampling rate should be chosen.

    Original languageEnglish
    Title of host publication2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
    Pages579-584
    Number of pages6
    DOIs
    Publication statusPublished - 2011
    Event2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 - Singapore
    Duration: 2011 Dec 72011 Dec 9

    Other

    Other2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
    CitySingapore
    Period11/12/711/12/9

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    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Cite this

    Shi, H. B., & Ueda, T. (2011). Investigation on the optimum sampling rate of strain measurement during printed circuit board (PCB) system assembly. In 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 (pp. 579-584). [6184487] https://doi.org/10.1109/EPTC.2011.6184487