Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment

N. Unami*, H. Noma, K. Sakuma, A. Shigetou, S. Shoji, J. Mizuno

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds