Joule heating induced local electrodeposition for microelectronic circuits

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A fundamental study is performed for local electrodeposition of copper utilizing thermal potential induced by Joule heating. The feasibility of the process for microelectronic applications is assessed by both experiment and mathematical modeling. The results of the investigation show that (i) a copper wire is coated under conditions of a.c. 50 Hz Joule heating in electrolyte containing 1.0 M CuSO4 and 0.5 m H2SO4 with relatively high deposition rate of about 0.4 μm min-1, (ii) the Joule heating current should be kept below the boiling point of the solution to realize uniform deposition, and (iii) results of calculations by the present model based on one-dimensional heat conduction agree well with experimental results.

Original languageEnglish
Pages (from-to)435-442
Number of pages8
JournalJournal of Applied Electrochemistry
Volume23
Issue number5
DOIs
Publication statusPublished - 1993 May
Externally publishedYes

Fingerprint

Joule heating
Electrodeposition
Microelectronics
Networks (circuits)
Copper
Boiling point
Deposition rates
Heat conduction
Electrolytes
Wire
Experiments

ASJC Scopus subject areas

  • Electrochemistry

Cite this

Joule heating induced local electrodeposition for microelectronic circuits. / Kawamoto, Hiroyuki.

In: Journal of Applied Electrochemistry, Vol. 23, No. 5, 05.1993, p. 435-442.

Research output: Contribution to journalArticle

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