Joule heating induced local electrodeposition for microelectronic circuits

A fundamental study is performed for local electrodeposition of copper utilizing thermal potential induced by Joule heating. The feasibility of the process for microelectronic applications is assessed by both experiment and mathematical modeling. The results of the investigation show that (i) a copper wire is coated under conditions of a.c. 50 Hz Joule heating in electrolyte containing 1.0 M CuSO₄ and 0.5 m H₂SO₄ with relatively high deposition rate of about 0.4 μm min^-1, (ii) the Joule heating current should be kept below the boiling point of the solution to realize uniform deposition, and (iii) results of calculations by the present model based on one-dimensional heat conduction agree well with experimental results.