Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

Jianfeng Yan, Guisheng Zou, Xiaoyu Wang, Hailin Bai, Fengwen Mu, Aiping Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Lead is a toxic element which usually brings harm to natural resources and human health. The use of Pb-containing solder alloys are forbidden to be employed in electronic packaging, which led to the great efforts to the investigation and implementation of lead-free bonding materials. The novel low temperature sintering bonding using metal nanoparticles is a promising technique for lead free bonding method used in electronic packaging industry. In this article, a large scale chemical reduction method to synthesize silver nanoparticles (Ag NPs) for this low temperature bonding application was put forward. The obtained Ag NPs were confirmed by XRD to be crystalline silver with a face-centered cubic (fee) structure. We observed monodisperse spherical Ag NPs with a diameter range of 35 ± 15 nm. The influence of reaction parameters on the resulting particle size and its distribution is investigated. Robust joints were formed using the Ag NPs as the bonding materials at the low bonding temperature. The shear strengths of joints reach about 49.93 MPa at low temperature of 250 °C. The results show that the Ag NPs synthesized by this large scale chemical reduction method are suitable to be used as low temperature lead bonding material in electronic packaging industry.

Original languageEnglish
Title of host publicationICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
Pages254-259
Number of pages6
DOIs
Publication statusPublished - 2011 Nov 22
Externally publishedYes
Event2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China
Duration: 2011 Aug 82011 Aug 11

Publication series

NameICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Conference

Conference2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
CountryChina
CityShanghai
Period11/8/811/8/11

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Keywords

  • Ag nanoparticles
  • electronic packaging
  • lead free
  • low temperature bonding
  • polyol process

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Yan, J., Zou, G., Wang, X., Bai, H., Mu, F., & Wu, A. (2011). Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 254-259). [6066831] (ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging). https://doi.org/10.1109/ICEPT.2011.6066831