TY - GEN
T1 - Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application
AU - Yan, Jianfeng
AU - Zou, Guisheng
AU - Wang, Xiaoyu
AU - Bai, Hailin
AU - Mu, Fengwen
AU - Wu, Aiping
PY - 2011/11/22
Y1 - 2011/11/22
N2 - Lead is a toxic element which usually brings harm to natural resources and human health. The use of Pb-containing solder alloys are forbidden to be employed in electronic packaging, which led to the great efforts to the investigation and implementation of lead-free bonding materials. The novel low temperature sintering bonding using metal nanoparticles is a promising technique for lead free bonding method used in electronic packaging industry. In this article, a large scale chemical reduction method to synthesize silver nanoparticles (Ag NPs) for this low temperature bonding application was put forward. The obtained Ag NPs were confirmed by XRD to be crystalline silver with a face-centered cubic (fee) structure. We observed monodisperse spherical Ag NPs with a diameter range of 35 ± 15 nm. The influence of reaction parameters on the resulting particle size and its distribution is investigated. Robust joints were formed using the Ag NPs as the bonding materials at the low bonding temperature. The shear strengths of joints reach about 49.93 MPa at low temperature of 250 °C. The results show that the Ag NPs synthesized by this large scale chemical reduction method are suitable to be used as low temperature lead bonding material in electronic packaging industry.
AB - Lead is a toxic element which usually brings harm to natural resources and human health. The use of Pb-containing solder alloys are forbidden to be employed in electronic packaging, which led to the great efforts to the investigation and implementation of lead-free bonding materials. The novel low temperature sintering bonding using metal nanoparticles is a promising technique for lead free bonding method used in electronic packaging industry. In this article, a large scale chemical reduction method to synthesize silver nanoparticles (Ag NPs) for this low temperature bonding application was put forward. The obtained Ag NPs were confirmed by XRD to be crystalline silver with a face-centered cubic (fee) structure. We observed monodisperse spherical Ag NPs with a diameter range of 35 ± 15 nm. The influence of reaction parameters on the resulting particle size and its distribution is investigated. Robust joints were formed using the Ag NPs as the bonding materials at the low bonding temperature. The shear strengths of joints reach about 49.93 MPa at low temperature of 250 °C. The results show that the Ag NPs synthesized by this large scale chemical reduction method are suitable to be used as low temperature lead bonding material in electronic packaging industry.
KW - Ag nanoparticles
KW - electronic packaging
KW - lead free
KW - low temperature bonding
KW - polyol process
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UR - http://www.scopus.com/inward/citedby.url?scp=81355142570&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2011.6066831
DO - 10.1109/ICEPT.2011.6066831
M3 - Conference contribution
AN - SCOPUS:81355142570
SN - 9781457717680
T3 - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
SP - 254
EP - 259
BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Y2 - 8 August 2011 through 11 August 2011
ER -
