Lateral current injection membrane buried heterostructure lasers integrated on 200-nm-thick si waveguide

Takuma Aihara, Tatsurou Hiraki, Koji Takeda, Koichi Hasebe, Takuro Fujii, Tai Tsuchizawa, Takaaki Kakitsuka, Shinji Matsuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Heterogeneous integration of lasers and 200-nm-thick Si waveguides is the key to realizing high-performance transmitters. A 500-μm-long DFB laser on Si waveguide exhibits 4.6-mW fiber coupled output power at 25°C and lasing up to 130°C.

Original languageEnglish
Title of host publication2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
ISBN (Electronic)9781943580385
Publication statusPublished - 2018 Jun 13
Externally publishedYes
Event2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - San Diego, United States
Duration: 2018 Mar 112018 Mar 15

Publication series

Name2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings

Other

Other2018 Optical Fiber Communications Conference and Exposition, OFC 2018
CountryUnited States
CitySan Diego
Period18/3/1118/3/15

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Signal Processing
  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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  • Cite this

    Aihara, T., Hiraki, T., Takeda, K., Hasebe, K., Fujii, T., Tsuchizawa, T., Kakitsuka, T., & Matsuo, S. (2018). Lateral current injection membrane buried heterostructure lasers integrated on 200-nm-thick si waveguide. In 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings (pp. 1-3). (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc..