Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability

Shinji Ishikawa; Tomoyuki Uchiyama; Eiji Hashino; Taro Kohno; Masamoto Tanaka; Kohei Tatsumi

doi:10.1109/ECTC.2007.373901

Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability

Shinji Ishikawa, Tomoyuki Uchiyama, Eiji Hashino, Taro Kohno, Masamoto Tanaka, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-μm pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/CuUBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to various solders by changing the thickness of the surface Cu layer according to the composition of the solder.

Original language	English
Title of host publication	Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages	872-877
Number of pages	6
DOIs	https://doi.org/10.1109/ECTC.2007.373901
Publication status	Published - 2007
Externally published	Yes
Event	57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States Duration: 2007 May 29 → 2007 Jun 1

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	57th Electronic Components and Technology Conference 2007, ECTC '07
Country	United States
City	Sparks, NV
Period	07/5/29 → 07/6/1

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2007.373901

Fingerprint Dive into the research topics of 'Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability'. Together they form a unique fingerprint.

Cite this

Ishikawa, S., Uchiyama, T., Hashino, E., Kohno, T., Tanaka, M., & Tatsumi, K. (2007). Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 872-877). [4249987] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.373901

Lead-free solder micro-ball bumps for the next generation of flip chip interconnection : Micro-ball materials, bump formation process and reliability. / Ishikawa, Shinji; Uchiyama, Tomoyuki; Hashino, Eiji; Kohno, Taro; Tanaka, Masamoto; Tatsumi, Kohei.

Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. p. 872-877 4249987 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ishikawa, S, Uchiyama, T, Hashino, E, Kohno, T, Tanaka, M & Tatsumi, K 2007, Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability. in Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07., 4249987, Proceedings - Electronic Components and Technology Conference, pp. 872-877, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, United States, 07/5/29. https://doi.org/10.1109/ECTC.2007.373901

Ishikawa S, Uchiyama T, Hashino E, Kohno T, Tanaka M, Tatsumi K. Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. p. 872-877. 4249987. (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.373901

Ishikawa, Shinji ; Uchiyama, Tomoyuki ; Hashino, Eiji ; Kohno, Taro ; Tanaka, Masamoto ; Tatsumi, Kohei. / Lead-free solder micro-ball bumps for the next generation of flip chip interconnection : Micro-ball materials, bump formation process and reliability. Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. pp. 872-877 (Proceedings - Electronic Components and Technology Conference).

@inproceedings{9c6872a0e1874e4c89765486afaee7d4,

title = "Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability",

abstract = "Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-μm pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/CuUBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to various solders by changing the thickness of the surface Cu layer according to the composition of the solder.",

author = "Shinji Ishikawa and Tomoyuki Uchiyama and Eiji Hashino and Taro Kohno and Masamoto Tanaka and Kohei Tatsumi",

year = "2007",

doi = "10.1109/ECTC.2007.373901",

language = "English",

isbn = "1424409853",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "872--877",

booktitle = "Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07",

note = "57th Electronic Components and Technology Conference 2007, ECTC '07 ; Conference date: 29-05-2007 Through 01-06-2007",

}

TY - GEN

T1 - Lead-free solder micro-ball bumps for the next generation of flip chip interconnection

T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07

AU - Ishikawa, Shinji

AU - Uchiyama, Tomoyuki

AU - Hashino, Eiji

AU - Kohno, Taro

AU - Tanaka, Masamoto

AU - Tatsumi, Kohei

PY - 2007

Y1 - 2007

N2 - Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-μm pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/CuUBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to various solders by changing the thickness of the surface Cu layer according to the composition of the solder.

AB - Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-μm pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/CuUBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to various solders by changing the thickness of the surface Cu layer according to the composition of the solder.

UR - http://www.scopus.com/inward/record.url?scp=35348831669&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=35348831669&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2007.373901

DO - 10.1109/ECTC.2007.373901

M3 - Conference contribution

AN - SCOPUS:35348831669

SN - 1424409853

SN - 9781424409853

T3 - Proceedings - Electronic Components and Technology Conference

SP - 872

EP - 877

BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07

Y2 - 29 May 2007 through 1 June 2007

ER -