Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability

Shinji Ishikawa, Tomoyuki Uchiyama, Eiji Hashino, Taro Kohno, Masamoto Tanaka, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-μm pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/CuUBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to various solders by changing the thickness of the surface Cu layer according to the composition of the solder.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages872-877
Number of pages6
DOIs
Publication statusPublished - 2007
Externally publishedYes
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV
Duration: 2007 May 292007 Jun 1

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
CitySparks, NV
Period07/5/2907/6/1

Fingerprint

Soldering alloys
Spalling
Chemical analysis
Tin
Lead-free solders
Repair
Inspection
Productivity

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Ishikawa, S., Uchiyama, T., Hashino, E., Kohno, T., Tanaka, M., & Tatsumi, K. (2007). Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability. In Proceedings - Electronic Components and Technology Conference (pp. 872-877). [4249987] https://doi.org/10.1109/ECTC.2007.373901

Lead-free solder micro-ball bumps for the next generation of flip chip interconnection : Micro-ball materials, bump formation process and reliability. / Ishikawa, Shinji; Uchiyama, Tomoyuki; Hashino, Eiji; Kohno, Taro; Tanaka, Masamoto; Tatsumi, Kohei.

Proceedings - Electronic Components and Technology Conference. 2007. p. 872-877 4249987.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ishikawa, S, Uchiyama, T, Hashino, E, Kohno, T, Tanaka, M & Tatsumi, K 2007, Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability. in Proceedings - Electronic Components and Technology Conference., 4249987, pp. 872-877, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, 07/5/29. https://doi.org/10.1109/ECTC.2007.373901
Ishikawa S, Uchiyama T, Hashino E, Kohno T, Tanaka M, Tatsumi K. Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability. In Proceedings - Electronic Components and Technology Conference. 2007. p. 872-877. 4249987 https://doi.org/10.1109/ECTC.2007.373901
Ishikawa, Shinji ; Uchiyama, Tomoyuki ; Hashino, Eiji ; Kohno, Taro ; Tanaka, Masamoto ; Tatsumi, Kohei. / Lead-free solder micro-ball bumps for the next generation of flip chip interconnection : Micro-ball materials, bump formation process and reliability. Proceedings - Electronic Components and Technology Conference. 2007. pp. 872-877
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