Abstract
Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-μm pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/CuUBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to various solders by changing the thickness of the surface Cu layer according to the composition of the solder.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - Electronic Components and Technology Conference |
| Pages | 872-877 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 2007 |
| Externally published | Yes |
| Event | 57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV Duration: 2007 May 29 → 2007 Jun 1 |
Other
| Other | 57th Electronic Components and Technology Conference 2007, ECTC '07 |
|---|---|
| City | Sparks, NV |
| Period | 07/5/29 → 07/6/1 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Lead-free solder micro-ball bumps for the next generation of flip chip interconnection : Micro-ball materials, bump formation process and reliability. / Ishikawa, Shinji; Uchiyama, Tomoyuki; Hashino, Eiji; Kohno, Taro; Tanaka, Masamoto; Tatsumi, Kohei.
Proceedings - Electronic Components and Technology Conference. 2007. p. 872-877 4249987.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Lead-free solder micro-ball bumps for the next generation of flip chip interconnection
T2 - Micro-ball materials, bump formation process and reliability
AU - Ishikawa, Shinji
AU - Uchiyama, Tomoyuki
AU - Hashino, Eiji
AU - Kohno, Taro
AU - Tanaka, Masamoto
AU - Tatsumi, Kohei
PY - 2007
Y1 - 2007
N2 - Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-μm pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/CuUBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to various solders by changing the thickness of the surface Cu layer according to the composition of the solder.
AB - Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-μm pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/CuUBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to various solders by changing the thickness of the surface Cu layer according to the composition of the solder.
UR - http://www.scopus.com/inward/record.url?scp=35348831669&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=35348831669&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2007.373901
DO - 10.1109/ECTC.2007.373901
M3 - Conference contribution
AN - SCOPUS:35348831669
SN - 1424409853
SN - 9781424409853
SP - 872
EP - 877
BT - Proceedings - Electronic Components and Technology Conference
ER -