Liquid-phase packaging of a glucose oxidase solution with parylene direct encapsulation and an ultraviolet curing adhesive cover for glucose sensors

Seiichi Takamatsu, Hisanori Takano, Nguyen Binh-Khiem, Tomoyuki Takahata, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama

Research output: Contribution to journalArticle

7 Citations (Scopus)


We have developed a package for disposable glucose sensor chips using Parylene encapsulation of a glucose oxidase solution in the liquid phase and a cover structure made of an ultraviolet (UV) curable adhesive. Parylene was directly deposited onto a small volume (1 μL) of glucose oxidase solution through chemical vapor deposition. The cover and reaction chamber were constructed on Parylene film using a UV-curable adhesive and photolithography. The package was processed at room temperature to avoid denaturation of the glucose oxidase. The glucose oxidase solution was encapsulated and unsealed. Glucose sensing was demonstrated using standard amperometric detection at glucose concentrations between 0.1 and 100 mM, which covers the glucose concentration range of diabetic patients. Our proposed Parylene encapsulation and UV-adhesive cover form a liquid phase glucose-oxidase package that has the advantages of room temperature processing and direct liquid encapsulation of a small volume solution without use of conventional solidifying chemicals.

Original languageEnglish
Pages (from-to)5888-5898
Number of pages11
Issue number6
Publication statusPublished - 2010 Jun
Externally publishedYes



  • Glucose oxidase
  • Glucose sensor
  • Packaging
  • Parylene

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics
  • Analytical Chemistry
  • Biochemistry

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