Long-term Reliability of Nickel Micro-Plating Bonding by Using Resonant Type Fatigue Testing Machine

Xinguang Yu, Ryota Domen, Isamu Morisako, Keiko Koshiba, Tomonori Iizuka, Kohei Tatsumi*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Recently, SiC (silicon carbide) has attracted attention as a new material to replace silicon power semiconductors. Since SiC is a wide-bandgap semiconductor and has high heat resistance, it can be operated in a high temperature environment. However, the conventional power module package is mainly joined by a low melting point material such as lead-free solder, and interconnection does not have enough heat resistance. Therefore, we have been proposing and experimenting with Nickel Micro-Plating Bonding (NMPB) using Ni (nickel), which has excellent heat resistance and strong bonding strength, as a new bonding method. Although various researches have been conducted on the bonding reliability of NMPB, long-term reliability evaluated from the aspect of metal fatigue has not been much discussed. In this study, a test has been conducted using a resonant type fatigue testing machine and examined whether acceleration of fatigue evaluation time and long-term reliability of NMPB were confirmed.

Original languageEnglish
Pages (from-to)1-8
Number of pages8
JournalYosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Volume40
Issue number1
DOIs
Publication statusPublished - 2022

Keywords

  • High heat resistance
  • Interconnection
  • Long-term reliability
  • Micro-plating
  • Nickel
  • Silicon carbide

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Surfaces, Coatings and Films
  • Metals and Alloys

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