Low-cost and reliable packaging technology for stacked MCP with MEMS and control IC chips

Mitsuyoshi Endo, Akihiro Kojima, Yoshiaki Shimooka, Yoshiaki Sugizaki, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi, Tatsuya Ohguro, Susumu Obata, Yusaku Asano, Takeshi Miyagi, Ikuo Mori, Yoshiaki Toyoshima, Hideki Shibata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper reports a wafer-level package (WLP) encapsulation and a stacked multi-chip package (MCP) for electrostatically actuated MEMS variable capacitor and control IC chips. Since the MEMS capacitor needs to be operated in dry atmosphere, we developed the WLP encapsulation structure with four thin-film layers fabricated by conventional back-end-of-the-line (BEOL) LSI technologies. Furthermore, since a MEMS chip is actuated by a control IC chip that provides high voltage, we developed the stacked MCP to integrate the MEMS chip and the control IC chip. In order to handle relatively fragile WLP encapsulation, the stacked MCP process was optimized. The stacked MCP has 4.5×4.5mm size and 0.8mm thickness, which is the thinnest package for stacked MEMS and IC chips. Normal operation of the MEMS variable capacitor in the stacked MCP confirmed up to 85%RH after reliability tests, i.e. temperature cycling, accelerated moisture resistance, and moisture/reflow sensitivity.

Original languageEnglish
Title of host publicationProceedings - 2009 International Symposium on Microelectronics, IMAPS 2009
Pages166-173
Number of pages8
Publication statusPublished - 2009 Dec 1
Event42nd International Symposium on Microelectronics, IMAPS 2009 - San Jose, CA, United States
Duration: 2009 Nov 12009 Nov 5

Publication series

NameProceedings - 2009 International Symposium on Microelectronics, IMAPS 2009

Conference

Conference42nd International Symposium on Microelectronics, IMAPS 2009
CountryUnited States
CitySan Jose, CA
Period09/11/109/11/5

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Keywords

  • MEMS capacitor
  • Stacked multi-chip package
  • Wafer-level package

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Endo, M., Kojima, A., Shimooka, Y., Sugizaki, Y., Yamazaki, H., Ogawa, E., Ikehashi, T., Ohguro, T., Obata, S., Asano, Y., Miyagi, T., Mori, I., Toyoshima, Y., & Shibata, H. (2009). Low-cost and reliable packaging technology for stacked MCP with MEMS and control IC chips. In Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009 (pp. 166-173). (Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009).