TY - GEN
T1 - Low-cost and reliable packaging technology for stacked MCP with MEMS and control IC chips
AU - Endo, Mitsuyoshi
AU - Kojima, Akihiro
AU - Shimooka, Yoshiaki
AU - Sugizaki, Yoshiaki
AU - Yamazaki, Hiroaki
AU - Ogawa, Etsuji
AU - Ikehashi, Tamio
AU - Ohguro, Tatsuya
AU - Obata, Susumu
AU - Asano, Yusaku
AU - Miyagi, Takeshi
AU - Mori, Ikuo
AU - Toyoshima, Yoshiaki
AU - Shibata, Hideki
PY - 2009/12/1
Y1 - 2009/12/1
N2 - This paper reports a wafer-level package (WLP) encapsulation and a stacked multi-chip package (MCP) for electrostatically actuated MEMS variable capacitor and control IC chips. Since the MEMS capacitor needs to be operated in dry atmosphere, we developed the WLP encapsulation structure with four thin-film layers fabricated by conventional back-end-of-the-line (BEOL) LSI technologies. Furthermore, since a MEMS chip is actuated by a control IC chip that provides high voltage, we developed the stacked MCP to integrate the MEMS chip and the control IC chip. In order to handle relatively fragile WLP encapsulation, the stacked MCP process was optimized. The stacked MCP has 4.5×4.5mm size and 0.8mm thickness, which is the thinnest package for stacked MEMS and IC chips. Normal operation of the MEMS variable capacitor in the stacked MCP confirmed up to 85%RH after reliability tests, i.e. temperature cycling, accelerated moisture resistance, and moisture/reflow sensitivity.
AB - This paper reports a wafer-level package (WLP) encapsulation and a stacked multi-chip package (MCP) for electrostatically actuated MEMS variable capacitor and control IC chips. Since the MEMS capacitor needs to be operated in dry atmosphere, we developed the WLP encapsulation structure with four thin-film layers fabricated by conventional back-end-of-the-line (BEOL) LSI technologies. Furthermore, since a MEMS chip is actuated by a control IC chip that provides high voltage, we developed the stacked MCP to integrate the MEMS chip and the control IC chip. In order to handle relatively fragile WLP encapsulation, the stacked MCP process was optimized. The stacked MCP has 4.5×4.5mm size and 0.8mm thickness, which is the thinnest package for stacked MEMS and IC chips. Normal operation of the MEMS variable capacitor in the stacked MCP confirmed up to 85%RH after reliability tests, i.e. temperature cycling, accelerated moisture resistance, and moisture/reflow sensitivity.
KW - MEMS capacitor
KW - Stacked multi-chip package
KW - Wafer-level package
UR - http://www.scopus.com/inward/record.url?scp=84866843600&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84866843600&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84866843600
SN - 0930815890
SN - 9780930815899
T3 - Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009
SP - 166
EP - 173
BT - Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009
T2 - 42nd International Symposium on Microelectronics, IMAPS 2009
Y2 - 1 November 2009 through 5 November 2009
ER -