Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Akira Ohki, Ryuzo Iga, Hiroyuki Ishii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We developed the first compact 100GbE optical transmitter to use flip-chip interconnects for the first time. The flip-chip interconnects provide low crosstalk and a high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved by 10% to 27% compared with that of a wire interconnection module.

Original languageEnglish
Title of host publication2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2013 25th International Conference on Indium Phosphide and Related Materials, IPRM 2013 - Kobe
Duration: 2013 May 192013 May 23

Other

Other2013 25th International Conference on Indium Phosphide and Related Materials, IPRM 2013
CityKobe
Period13/5/1913/5/23

Fingerprint

Crosstalk
Masks
Modulation
Wire
Bandwidth
Optical transmitters

Keywords

  • 100 Gigabit Ethernet
  • DFB laser
  • EADFB laser array
  • EAM
  • flip-chip
  • Photonic integrated circuits

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kanazawa, S., Fujisawa, T., Takahata, K., Ohki, A., Iga, R., & Ishii, H. (2013). Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects. In 2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013 [6562619] https://doi.org/10.1109/ICIPRM.2013.6562619

Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects. / Kanazawa, Shigeru; Fujisawa, Takeshi; Takahata, Kiyoto; Ohki, Akira; Iga, Ryuzo; Ishii, Hiroyuki.

2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013. 2013. 6562619.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kanazawa, S, Fujisawa, T, Takahata, K, Ohki, A, Iga, R & Ishii, H 2013, Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects. in 2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013., 6562619, 2013 25th International Conference on Indium Phosphide and Related Materials, IPRM 2013, Kobe, 13/5/19. https://doi.org/10.1109/ICIPRM.2013.6562619
Kanazawa S, Fujisawa T, Takahata K, Ohki A, Iga R, Ishii H. Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects. In 2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013. 2013. 6562619 https://doi.org/10.1109/ICIPRM.2013.6562619
Kanazawa, Shigeru ; Fujisawa, Takeshi ; Takahata, Kiyoto ; Ohki, Akira ; Iga, Ryuzo ; Ishii, Hiroyuki. / Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects. 2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013. 2013.
@inproceedings{8f80d340e5784545933309f9fdd10432,
title = "Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects",
abstract = "We developed the first compact 100GbE optical transmitter to use flip-chip interconnects for the first time. The flip-chip interconnects provide low crosstalk and a high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved by 10{\%} to 27{\%} compared with that of a wire interconnection module.",
keywords = "100 Gigabit Ethernet, DFB laser, EADFB laser array, EAM, flip-chip, Photonic integrated circuits",
author = "Shigeru Kanazawa and Takeshi Fujisawa and Kiyoto Takahata and Akira Ohki and Ryuzo Iga and Hiroyuki Ishii",
year = "2013",
doi = "10.1109/ICIPRM.2013.6562619",
language = "English",
isbn = "9781467361309",
booktitle = "2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013",

}

TY - GEN

T1 - Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects

AU - Kanazawa, Shigeru

AU - Fujisawa, Takeshi

AU - Takahata, Kiyoto

AU - Ohki, Akira

AU - Iga, Ryuzo

AU - Ishii, Hiroyuki

PY - 2013

Y1 - 2013

N2 - We developed the first compact 100GbE optical transmitter to use flip-chip interconnects for the first time. The flip-chip interconnects provide low crosstalk and a high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved by 10% to 27% compared with that of a wire interconnection module.

AB - We developed the first compact 100GbE optical transmitter to use flip-chip interconnects for the first time. The flip-chip interconnects provide low crosstalk and a high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved by 10% to 27% compared with that of a wire interconnection module.

KW - 100 Gigabit Ethernet

KW - DFB laser

KW - EADFB laser array

KW - EAM

KW - flip-chip

KW - Photonic integrated circuits

UR - http://www.scopus.com/inward/record.url?scp=84882296017&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84882296017&partnerID=8YFLogxK

U2 - 10.1109/ICIPRM.2013.6562619

DO - 10.1109/ICIPRM.2013.6562619

M3 - Conference contribution

SN - 9781467361309

BT - 2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013

ER -