Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Akira Ohki, Ryuzo Iga, Hiroyuki Ishii

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We developed the first compact 100GbE optical transmitter to use flip-chip interconnects for the first time. The flip-chip interconnects provide low crosstalk and a high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved by 10% to 27% compared with that of a wire interconnection module.

Original languageEnglish
Title of host publication2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013
DOIs
Publication statusPublished - 2013 Aug 26
Event2013 25th International Conference on Indium Phosphide and Related Materials, IPRM 2013 - Kobe, Japan
Duration: 2013 May 192013 May 23

Publication series

NameConference Proceedings - International Conference on Indium Phosphide and Related Materials
ISSN (Print)1092-8669

Conference

Conference2013 25th International Conference on Indium Phosphide and Related Materials, IPRM 2013
CountryJapan
CityKobe
Period13/5/1913/5/23

Keywords

  • 100 Gigabit Ethernet
  • DFB laser
  • EADFB laser array
  • EAM
  • Photonic integrated circuits
  • flip-chip

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Kanazawa, S., Fujisawa, T., Takahata, K., Ohki, A., Iga, R., & Ishii, H. (2013). Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects. In 2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013 [6562619] (Conference Proceedings - International Conference on Indium Phosphide and Related Materials). https://doi.org/10.1109/ICIPRM.2013.6562619