Low-latency fiber-wireless bridge for flexible fronthauling in future mobile networks

Pham Tien Dat, Atsushi Kanno, Tetsuya Kawanishi

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    We propose a flexible and low-latency cascaded fiber-wireless system for future mobile fronthauling using seamless combination of fiber-optic and millimeter-wave links. Successful transmission of intraband and interband carrier aggregation LTE-A signals over the system is experimentally confirmed. Satisfactory performance is achieved owing to the use of a high-quality optical millimeter-wave signal generation technique at the transmitter and a proposed high-performance self-homodyne detection at the receiver.

    Original languageEnglish
    Title of host publicationEuropean Microwave Week 2015: "Freedom Through Microwaves", EuMW 2015 - Conference Proceedings; 2015 45th European Microwave Conference Proceedings, EuMC
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1156-1159
    Number of pages4
    ISBN (Print)9782874870392
    DOIs
    Publication statusPublished - 2015 Dec 2
    Event45th European Microwave Conference, EuMC 2015 - Paris, France
    Duration: 2015 Sep 72015 Sep 10

    Other

    Other45th European Microwave Conference, EuMC 2015
    CountryFrance
    CityParis
    Period15/9/715/9/10

    Keywords

    • fiber-wireless
    • millimeter-wave
    • mobile fronthaul
    • mobile networks
    • radio-over-fiber

    ASJC Scopus subject areas

    • Computer Networks and Communications
    • Electrical and Electronic Engineering
    • Radiation

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  • Cite this

    Dat, P. T., Kanno, A., & Kawanishi, T. (2015). Low-latency fiber-wireless bridge for flexible fronthauling in future mobile networks. In European Microwave Week 2015: "Freedom Through Microwaves", EuMW 2015 - Conference Proceedings; 2015 45th European Microwave Conference Proceedings, EuMC (pp. 1156-1159). [7345973] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuMC.2015.7345973