TY - GEN
T1 - Low temperature all-Cu bonding via Cu-nanoparticle paste sintering in Pt-catalyzed formic acid vapor
AU - Mu, Fengwen
AU - Ren, Hui
AU - Shin, Seongbin
AU - Masatake, Akaike
AU - Liu, Lei
AU - Zou, Guisheng
AU - Makoto, Yoshida
AU - Suga, Tadatomo
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by The Cross-ministerial Strategic Innovation Promotion Program (SIP) 2018 of Japan, National Key Research and Development Program of China (2017YFB1104900) and National Natural Science Foundation of China (Grant 51520105007, 51775299).
Publisher Copyright:
© 2019 JSPS 191st Committee on Innovative Interface Bonding Technology.
PY - 2019/5
Y1 - 2019/5
N2 - A low temperature all-Cu bonding was realized via the combination of Cu nanoparticle paste and Pt-catalyzed formic acid vapor, which has a large tolerance of surface oxidation. This novel method can even achieve the bonding of oxidized-Cu at 250°C with a shear strength of 20.6 MPa.
AB - A low temperature all-Cu bonding was realized via the combination of Cu nanoparticle paste and Pt-catalyzed formic acid vapor, which has a large tolerance of surface oxidation. This novel method can even achieve the bonding of oxidized-Cu at 250°C with a shear strength of 20.6 MPa.
UR - http://www.scopus.com/inward/record.url?scp=85068354874&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068354874&partnerID=8YFLogxK
U2 - 10.23919/LTB-3D.2019.8735224
DO - 10.23919/LTB-3D.2019.8735224
M3 - Conference contribution
AN - SCOPUS:85068354874
T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
SP - 53
BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Y2 - 21 May 2019 through 25 May 2019
ER -