Low temperature all-Cu bonding via Cu-nanoparticle paste sintering in Pt-catalyzed formic acid vapor

Fengwen Mu, Hui Ren, Seongbin Shin, Akaike Masatake, Lei Liu, Guisheng Zou, Yoshida Makoto, Tadatomo Suga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A low temperature all-Cu bonding was realized via the combination of Cu nanoparticle paste and Pt-catalyzed formic acid vapor, which has a large tolerance of surface oxidation. This novel method can even achieve the bonding of oxidized-Cu at 250°C with a shear strength of 20.6 MPa.

Original languageEnglish
Title of host publicationProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages53
Number of pages1
ISBN (Electronic)9784904743072
DOIs
Publication statusPublished - 2019 May
Event6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
Duration: 2019 May 212019 May 25

Publication series

NameProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
CountryJapan
CityKanazawa, Ishikawa
Period19/5/2119/5/25

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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