Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps

Weixin Fu, Takashi Kasahara, Akiko Okada, Shuichi Shoji, Akitsu Shigetou, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A bonding method using single-micrometer bumps, which were formed by Ag nanoparticle, had been realized under low bonding temperature and low compressive stress. The bump diameter is 8 μm and the pitch is 16 μm. The bonding temperature was 250 °C under compressive stress of about 41.4 MPa. A shear test was carried out and the strength of the bond could reach 5.89 MPa.

Original languageEnglish
Title of host publicationProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PublisherIEEE Computer Society
Number of pages1
ISBN (Print)9781479952618
DOIs
Publication statusPublished - 2014 Jan 1
Event2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan
Duration: 2014 Jul 152014 Jul 16

Publication series

NameProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Conference

Conference2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
CountryJapan
CityTokyo
Period14/7/1514/7/16

ASJC Scopus subject areas

  • Filtration and Separation

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  • Cite this

    Fu, W., Kasahara, T., Okada, A., Shoji, S., Shigetou, A., & Mizuno, J. (2014). Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 [6886186] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886186