Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    This work is the first to achieve a low temperature (≦250 °C) and low pressure (≦0.1 MPa) fluxless bonding of plateless Cu-Cu substrates by transient liquid phase sintering (TLPS) of Ag nanoparticles and Sn-Bi eutectic powder. Sintering was conducted under formic environment to assist the wetting of Sn-Bi and to suppress the oxidation of Cu substrate. Effect of mixture composition to the shear strength, microstructure, and remelting temperature was investigated. The effect of formic gas environment to the shear strength and microstructure was also examined. It was found that shear strength of 30wt% added Sn-Bi (Ag-30SnBi) that was sintered at 250 °C was higher than 20 MPa, which is comparable to the conventional Pb-based solder. The determined remelting temperature by differential scanning calorimetry (DSC) test was found to shift to higher temperature compared to the Sn-Bi eutectic temperature, implying the possibility of high temperature operation. Formic gas environment was observed by SEM to assist the densification of the sintering microstructure by the reduction of the oxide layer on the sintering structure and subsequently promoting the formation of sintering necks.

    Original languageEnglish
    Title of host publication2017 IEEE CPMT Symposium Japan, ICSJ 2017
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages195-198
    Number of pages4
    Volume2017-January
    ISBN (Electronic)9781538627129
    DOIs
    Publication statusPublished - 2017 Dec 26
    Event2017 IEEE CPMT Symposium Japan, ICSJ 2017 - Kyoto, Japan
    Duration: 2017 Nov 202017 Nov 22

    Other

    Other2017 IEEE CPMT Symposium Japan, ICSJ 2017
    CountryJapan
    CityKyoto
    Period17/11/2017/11/22

    Keywords

    • silver nanoparticles
    • tin bismuth eutectic powders
    • transient liquid phase sintering

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

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  • Cite this

    Muhammad, K. F., Yamamoto, T., & Yoshida, M. (2017). Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application. In 2017 IEEE CPMT Symposium Japan, ICSJ 2017 (Vol. 2017-January, pp. 195-198). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2017.8240115