Low temperature Au-Au bonding with VUV/O 3 treatment

Akiko Okada, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma, Katsuyuki Sakuma, Jun Mizuno, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O 3 treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O 3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O 3 treatment. The Au-Au bonding with VUV/O 3 treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O 3 treatment is effective in Au-Au bonding.

Original languageEnglish
Title of host publication2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
Duration: 2012 Jan 312012 Feb 2

Publication series

Name2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Conference

Conference2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
CountryJapan
CityOsaka
Period12/1/3112/2/2

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ASJC Scopus subject areas

  • Control and Systems Engineering

Cite this

Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Mizuno, J., & Shoji, S. (2011). Low temperature Au-Au bonding with VUV/O 3 treatment. In 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 [6263015] (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011). https://doi.org/10.1109/3DIC.2012.6263015