Low temperature Au-Au bonding with VUV/O 3 treatment

Akiko Okada, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma, Katsuyuki Sakuma, Jun Mizuno, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes low temperature Au-Au bonding with vacuum ultraviolet (VUV) irradiation in the presence of oxygen gas. The VUV/O 3 treatment can remove organic contaminants of Au surfaces without damages. The Au surfaces after the VUV/O 3 treatment were analyzed by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results show that carbon-based contaminants were dramatically decreased and that there were no serious damages in Au surfaces by the VUV/O 3 treatment. The Au-Au bonding with VUV/O 3 treatment was achieved at 200 °C. The average of shear strength of about 80 MPa per unit area was obtained. Therefore, it was proved that VUV/O 3 treatment is effective in Au-Au bonding.

Original languageEnglish
Title of host publication2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs
Publication statusPublished - 2011
Event2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka
Duration: 2012 Jan 312012 Feb 2

Other

Other2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
CityOsaka
Period12/1/3112/2/2

Fingerprint

Vacuum
Temperature
Impurities
Shear strength
Atomic force microscopy
X ray photoelectron spectroscopy
Irradiation
Carbon
Oxygen
Gases

ASJC Scopus subject areas

  • Control and Systems Engineering

Cite this

Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., ... Shoji, S. (2011). Low temperature Au-Au bonding with VUV/O 3 treatment. In 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 [6263015] https://doi.org/10.1109/3DIC.2012.6263015

Low temperature Au-Au bonding with VUV/O 3 treatment. / Okada, Akiko; Nimura, Masatsugu; Unami, Naoko; Shigetou, Akitsu; Noma, Hirokazu; Sakuma, Katsuyuki; Mizuno, Jun; Shoji, Shuichi.

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011. 6263015.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Okada, A, Nimura, M, Unami, N, Shigetou, A, Noma, H, Sakuma, K, Mizuno, J & Shoji, S 2011, Low temperature Au-Au bonding with VUV/O 3 treatment. in 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011., 6263015, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, Osaka, 12/1/31. https://doi.org/10.1109/3DIC.2012.6263015
Okada A, Nimura M, Unami N, Shigetou A, Noma H, Sakuma K et al. Low temperature Au-Au bonding with VUV/O 3 treatment. In 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011. 6263015 https://doi.org/10.1109/3DIC.2012.6263015
Okada, Akiko ; Nimura, Masatsugu ; Unami, Naoko ; Shigetou, Akitsu ; Noma, Hirokazu ; Sakuma, Katsuyuki ; Mizuno, Jun ; Shoji, Shuichi. / Low temperature Au-Au bonding with VUV/O 3 treatment. 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011.
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