Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification

Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The direct bonding between polyether ether ketone (PEEK) and Pt was feasible at low temperature of 150 oC through vapor assisted VUV treatment. This technology was expected to be applied in future body implantable devices for medical applications. The carboxyl functional groups were created on the PEEK surface during the vapor assisted VUV treatment, as well as the hydrate compound was formed on Pt surface. The highest bonding strength and surface release energy reached 1.15 MPa and 4.6 × 10-1 N/m, respectively, which was considered strong and comparable with conventional PEEK-based direct bonding.

Original languageEnglish
Title of host publicationProceedings - ECTC 2016: 66th Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2541-2546
Number of pages6
Volume2016-August
ISBN (Electronic)9781509012039
DOIs
Publication statusPublished - 2016 Aug 16
Externally publishedYes
Event66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States
Duration: 2016 May 312016 Jun 3

Other

Other66th IEEE Electronic Components and Technology Conference, ECTC 2016
CountryUnited States
CityLas Vegas
Period16/5/3116/6/3

Keywords

  • Hybrid bonding
  • Low temperature bonding
  • PEEK
  • Surface modification
  • Vapor assisted VUV

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Fu, W., Shigetou, A., Shoji, S., & Mizuno, J. (2016). Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification. In Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference (Vol. 2016-August, pp. 2541-2546). [7545784] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2016.320